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1. CN110648979 - Integrated flexible substrate with high stretchability, and flexible circuit and manufacturing method thereof

Office China
Application Number 201910932694.5
Application Date 29.09.2019
Publication Number 110648979
Publication Date 03.01.2020
Publication Kind A
IPC
H01L 23/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 21/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
CPC
H01L 21/4803
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4803Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 23/145
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
145Organic substrates, e.g. plastic
Applicants TSINGHUA UNIVERSITY
清华大学
Inventors LIU RAN
刘冉
LIN RONGZAN
林荣赞
Agents 北京鸿元知识产权代理有限公司 11327
Title
(EN) Integrated flexible substrate with high stretchability, and flexible circuit and manufacturing method thereof
(ZH) 具有大拉伸性的一体化柔性基底与柔性电路及其制造方法
Abstract
(EN)
The invention discloses an integrated flexible substrate with high stretchability, and a flexible circuit and a manufacturing method thereof, and belongs to the technical field of flexible electronics. An integrated flexible substrate composed of various materials with different elasticity moduli is prepared, then a rigid element is placed on the substrate in a high elasticity modulus area, a flexible element is placed on the substrate in a low elasticity modulus area, and then the flexible element is packaged to obtain the flexible circuit. The strain isolation effect can be achieved, the requirement for rigid element protection is met, the stability and reliability of the whole device are improved, and the flexibility and stretchability of the flexible circuit are achieved.

(ZH)
本发明公开了具有大拉伸性的一体化柔性基底与柔性电路及其制造方法,属于柔性电子技术领域。通过制备由多种具有不同弹性模量的材料组成的一体化柔性基底,然后将刚性元件置于高弹性模量区域的基底上,将柔性元件置于低弹性模量区域的基底上,再对其封装,得到柔性电路。本发明可以达到应变隔离的效果,满足对刚性元件保护的要求,提高了整体器件的稳定性和可靠性,实现柔性电路的柔性和拉伸性。

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