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1. CN110574396 - MEMS sound sensor, MEMS microphone and electronic equipment

Office
China
Application Number 201880026695.7
Application Date 29.12.2018
Publication Number 110574396
Publication Date 13.12.2019
Grant Number 110574396
Grant Date 22.12.2020
Publication Kind B
IPC
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
CPC
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
Applicants GETTOP ACOUSTIC CO., LTD.
共达电声股份有限公司
Inventors HE XIANLONG
何宪龙
XIE GUANHONG
谢冠宏
QIU SHIJIA
邱士嘉
Agents 广州华进联合专利商标代理有限公司 44224
Title
(EN) MEMS sound sensor, MEMS microphone and electronic equipment
(ZH) MEMS声音传感器、MEMS麦克风及电子设备
Abstract
(EN)
A MEMS sound sensor includes: a substrate; a first sound sensing unit and a second sound sensing unit arranged on the substrate, wherein the first sound sensing unit is used for detecting sound through at least one of air sound pressure change and mechanical vibration, and the first sound sensing unit comprises a first back plate arranged above the substrate; a first vibrating diaphragm arranged opposite to the first back plate, wherein a gap exists between the first vibrating diaphragm and the first back plate and the first vibrating diaphragm and the first back plate form a capacitor structure; a first connecting column, wherein a second end of the first connecting column is fixedly connected with the first back plate and the first vibrating diaphragm is fixedly supported on the first back plate. At least one mass block is arranged in the edge area of the first vibrating diaphragm; a gap exists between the mass block and the first back plate.

(ZH)
一种MEMS声音传感器,包括:基板;设置在基板上的第一声音传感单元及第二声音传感单元;其中,第一声音传感单元用于通过空气声压变化和机械振动中的至少一种来检测声音,第一声音传感单元包括第一背板,设置于基板上方;第一振膜,与第一背板相对设置且与第一背板之间存在间隙;第一振膜与第一背板构成电容结构;及第一连接柱,第一连接柱的第二端与第一背板固定连接;以将第一振膜固定支撑在第一背板上;其中,第一振膜的边缘区域设置有至少一个质量块;质量块与第一背板之间存在间隙。

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