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1. CN110058149 - Detection circuit for state of planted ball of isolated bonding pad

Office
China
Application Number 201910525025.6
Application Date 18.06.2019
Publication Number 110058149
Publication Date 26.07.2019
Grant Number 110058149
Grant Date 27.09.2019
Publication Kind B
IPC
G01R 31/28
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
CPC
G01R 31/2896
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2896Testing of IC packages; Test features related to IC packages
Applicants 2PAI SEMICONDUCTOR CO.,LIMITED
荣湃半导体(上海)有限公司
Inventors ZHANG XIAOLONG
张小龙
Agents 上海硕力知识产权代理事务所(普通合伙) 31251
Title
(EN) Detection circuit for state of planted ball of isolated bonding pad
(ZH) 一种隔离式焊盘的植球状态检测电路
Abstract
(EN) The invention relates to the field of semiconductors, and discloses a detection circuit for the state of a planted ball of an isolated bonding pad. The detection circuit comprises the isolated bondingpad, a bonding pad detection circuit and a chip; the isolated bonding pad comprises a first conductive area, an insulated isolation area and a second conductive area; the first conductive area and the second conductive area are isolated by the insulted isolation area; the bonding pad detection circuit detects the state of the planted ball on the isolated bonding pad; the chip controls the bondingpad detection circuit to detect a voltage signal of the isolated bonding pad within set time, and acquires the state of the planted ball on the isolated bonding pad via the bonding pad detection circuit; the bonding pad detection circuit comprises a first driving stage module, a second driving stage module, a first detection control module, a second detection control module and a voltage difference detection module. According to the detection circuit provided by the invention, the programmable control on the working condition of the chip is achieved through detecting the state of the plantedball of the isolated bonding pad, the physical cost of the chip can be reduced, and the work flexibility of the chip can be increased.
(ZH) 本发明涉及半导体领域,公开了一种隔离式焊盘的植球状态检测电路,包括:隔离式焊盘,焊盘检测电路,芯片;隔离式焊盘包括第一导电区,绝缘隔离区及第二导电区,绝缘隔离区隔离第一导电区和第二导电区;焊盘检测电路,检测在隔离式焊盘上植球的状态;芯片,控制焊盘检测电路在设定时间内检测隔离式焊盘的电压信号,通过焊盘检测电路获取隔离焊盘上的植球状态;其焊盘检测电路包括:第一驱动级模块、第二驱动级模块,第一检测控制模块、第二检测控制模块及电压差检测模块。本发明通过检测隔离式焊盘植球状态,实现对芯片工作状态的可编程控制,可以降低芯片物理成本,增加芯片工作的灵活性。