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1. CN109778116 - Mask, manufacturing method of mask and mask assembly

Office China
Application Number 201910244878.2
Application Date 28.03.2019
Publication Number 109778116
Publication Date 21.05.2019
Publication Kind A
IPC
C23C 14/04
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
C23C 14/24
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
CPC
C23C 14/04
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
C23C 14/24
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
Applicants BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
成都京东方光电科技有限公司
Inventors ZHENG YONG
郑勇
DU SHUAI
杜帅
DING WENBIAO
丁文彪
Agents 北京中博世达专利商标代理有限公司 11274
Title
(EN) Mask, manufacturing method of mask and mask assembly
(ZH) 一种掩膜版及其制作方法、掩膜版组件
Abstract
(EN)
The embodiment of the invention provides a mask, a manufacturing method of the mask and a mask assembly, and relates to the field of masks. The problem that welding failures are caused by the fact that laser energy is difficult to control during welding can be solved; the mask includes a mask pattern region and a non-mask pattern region around the mask pattern region; the mask pattern region includes at least one effective mask region; the effective mask region includes a plurality of evaporation holes and shielding strips located between the evaporation holes; the mask is provided with a soldering region in the non-masking pattern region; and at least the thickness of the soldering region of the non-masking pattern region of the mask is larger than the thickness of the shielding strips inthe effective mask region of the mask.

(ZH)
本发明实施例提供一种掩膜版及其制作方法、掩膜版组件,涉及掩膜版领域,能够解决掩膜版在焊接时因激光能量不易控制而造成的焊接不良;该掩膜版包括掩膜图案区以及位于掩膜图案区四周的非掩膜图案区;掩膜图案区包括至少一个有效掩膜区;有效掩膜区中包括:多个蒸镀孔,以及位于蒸镀孔和蒸镀孔之间的遮挡条;掩膜版在非掩膜图案区内设置有焊接区;掩膜版在非掩膜图案区内至少在焊接区的厚度,大于掩膜版在有效掩膜区的遮挡条的厚度。

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