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1. CN109728165 - Display backboard, manufacturing method thereof and display device

Office China
Application Number 201910007859.8
Application Date 04.01.2019
Publication Number 109728165
Publication Date 07.05.2019
Publication Kind A
IPC
H01L 51/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 21/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 27/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/1218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1218with a particular composition or structure of the substrate
H01L 27/1296
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1259Multistep manufacturing methods
1296adapted to increase the uniformity of device parameters
Applicants BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
鄂尔多斯市源盛光电有限责任公司
Inventors XUE ZHIYONG
薛智勇
BAI NINI
白妮妮
PENG LIMAN
彭利满
LIU LIANGLIANG
刘亮亮
ZHANG QIANQIAN
张倩倩
LIU SHUJIE
刘淑杰
LI HAILONG
李海龙
MA LINGLING
马玲玲
MI HONGYU
米红玉
LIU XU
刘旭
CHEN QIANG
陈强
JING GUODONG
景国栋
Agents 北京银龙知识产权代理有限公司 11243
北京银龙知识产权代理有限公司 11243
Title
(EN) Display backboard, manufacturing method thereof and display device
(ZH) 一种显示背板及其制作方法、显示装置
Abstract
(EN)
The invention discloses a display backboard, a manufacturing method and a display device, relates to the technical field of display, and aims at solving the problems that a recess area in a substrateof a display backboard in the prior art tends to influence identification of an alignment mark. The display backboard comprises a substrate, and an electronic device and an alignment mark arranged onthe substrate; and the display backboard also comprises a filling layer, the filling layer is positioned in at least part of the recess area in the surface, back to the electronic device, of the substrate, and the minimal distance between an orthographic projection of the at least part of the recess area on the substrate and an orthographic projection of the alignment mark on the substrate is lower than 200 micron. The display backboard is used to manufacture the display device.

(ZH)
本发明公开一种显示背板及其制作方法、显示装置,涉及显示技术领域,为解决现有技术中存在于显示背板中基底上的凹陷区域,容易对识别对位标识产生影响的问题。所述显示背板包括基底以及设置在所述基底上的电子器件和对位标识,所述显示背板还包括:填充层,所述填充层填充位于所述基底背向所述电子器件的表面的至少部分凹陷区域,所述至少部分凹陷区域在所述基底上的正投影与所述对位标识在所述基底上的正投影之间的最小距离小于200μm。本发明提供的显示背板用于制作显示装置。

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