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1. CN109716229 - CAMERA MODULE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

Office
China
Application Number 201780056492.8
Application Date 08.09.2017
Publication Number 109716229
Publication Date 03.05.2019
Grant Number 109716229
Grant Date 17.09.2021
Publication Kind B
IPC
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
G02B 7/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
H04N 5/225
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
G03B 30/00
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
30Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
CPC
G02B 7/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
H04N 5/225
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
G03B 17/55
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
55with provision for heating or cooling, e.g. in aircraft
H05K 1/0203
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
H05K 1/0281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
028Bending or folding regions of flexible printed circuits
0281Reinforcement details thereof
Applicants SONY SEMICONDUCTOR SOLUTIONS CORPORATION
索尼半导体解决方案公司
Inventors MOMIUCHI YUTA
籾内雄太
TAKAOKA YUJI
高冈裕二
NAKAYAMA HIROKAZU
中山浩和
TANAKA KIYOHISA
田仲清久
TOGAWA MIYOSHI
户川实荣
SEKI HIROKAZU
关大一
Agents 北京信慧永光知识产权代理有限责任公司 11290
北京信慧永光知识产权代理有限责任公司 11290
Priority Data 2016-185347 23.09.2016 JP
Title
(EN) CAMERA MODULE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
(ZH) 照相机模块、制造方法和电子装置
Abstract
(EN) The present technology relates to a camera module, a manufacturing method, and an electronic device with which reductions in positional accuracy and heat radiation performance of an optical module canbe suppressed. An imaging element is joined to one surface of a flexible substrate so that a light-receiving surface of the imaging element is exposed from an opening of the flexible substrate. An optical module is joined to the other surface of the flexible substrate so as to cause light to be incident on the imaging element, via the opening. A reinforcing member is joined to the periphery of the imaging element on the one surface of the flexible substrate, and reinforces a joint portion of the flexible substrate at which the optical module is joined. The reinforcing member is joined so as to oppose a range including at least part of the joint portion, and is configured so that part of the periphery of the imaging element is open. The present technology can be applied to, for example, acamera module in which an imaging element and an optical module are integrated.
(ZH) 本技术涉及一种可防止光学模块的定位精度或散热性能降低的照相机模块、制造方法和电子装置。摄像元件接合在柔性板的一个面上以使得所述摄像元件的光接收表面通过所述柔性板的开口部暴露,并且光学模块接合在所述柔性板的另一个面以使得光通过所述开口部进入所述摄像元件。加强构件接合在所述柔性板的所述一个面上而位于所述摄像元件的圆周处,并且加强所述柔性板的所述光学模块所接合的接合部。所述加强构件被接合以面向包括所述接合部的至少一部分的区域,并且被成形为使得所述摄像元件的所述圆周的一部分保持敞开。本技术可应用于例如其中所述摄像元件和所述光学模块集成的照相机模块。