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1. CN109638043 - Flexible organic light emitting diode (OLED) display substrate and manufacturing method thereof

Office China
Application Number 201811465761.9
Application Date 03.12.2018
Publication Number 109638043
Publication Date 16.04.2019
Publication Kind A
IPC
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
G09F 9/30
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
CPC
G09F 9/301
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
301flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
H01L 27/3288
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3281Passive matrix displays
3288Wiring lines
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
武汉华星光电半导体显示技术有限公司
Inventors JIA YONGZHEN
贾永臻
Agents 深圳翼盛智成知识产权事务所(普通合伙) 44300
Title
(EN) Flexible organic light emitting diode (OLED) display substrate and manufacturing method thereof
(ZH) 柔性有机发光二极管(OLED)显示基板及其制作方法
Abstract
(EN)
The invention provides a flexible organic light emitting diode (OLED) display substrate and a manufacturing method thereof. The flexible organic light emitting diode (OLED) display substrate comprisesa display area, a non-display area and a bending permissible area connecting the display area and the non-display area, and characterized in that the bending permissible area is provided with a plurality of liquid-state conductive lines which are arranged in a mutually-spaced mode, any one of the liquid-state conductive lines comprises a line flow channel arranged in the bending permissible areaand a metal line part connected with the two ends of the line flow channel, and a packaging layer is arranged on the line flow channel to store a liquid conductive material, wherein the liquid conductive material is sealed in the line flow channel. Therefore, the liquid-state conductive lines can greatly improve the yield of the bending permissible area, and the problem that the existing bending permissible area is easy to break in the bending process is solved.

(ZH)
本发明提供一种柔性有机发光二极管(OLED)显示基板及其制作方法,其中柔性有机发光二极管(OLED)显示基板包括显示区、非显示区及连接显示区和非显示区的弯折容许区,其特征在于,所述弯折容许区设有相互间格的多个液态导电线路,任一所述液态导电线路包括设于所述弯折容许区内的线路流道及连接线路流道两端的一金属线部,所述线路流道上设有封装层以储存液态导电材料,其中所述液态导电材料封闭于所述线路流道内。藉此,液态导电线路能够大幅提高弯折容许区的良品率,消除现行弯折容许区弯折过程易断线的问题。

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