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1. CN109638040 - Display structure and manufacturing method thereof

Office China
Application Number 201811430589.3
Application Date 28.11.2018
Publication Number 109638040
Publication Date 16.04.2019
Publication Kind A
IPC
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
G09F 9/33
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
CPC
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 27/3276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3276Wiring lines
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
Applicants WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
武汉华星光电半导体显示技术有限公司
Inventors WENG JINXUE
翁金学
Agents 深圳翼盛智成知识产权事务所(普通合伙) 44300
Title
(EN) Display structure and manufacturing method thereof
(ZH) 显示器结构及其制造方法
Abstract
(EN)
The invention discloses a display structure and a manufacturing method. The display structure comprises a substrate, a display element layer, an insulation protection layer, a plurality of display signal lines, a plurality of first connecting pads and a flip-chip thin film packaging piece. The first connecting pads are arranged on the back surface of the substrate and are connected with the plurality of display signal lines; and the flip-chip thin film packaging piece is provided with a plurality of second connecting pads which are electrically connected with the plurality of first connectingpads. According to the invention, the connection pads on the flip-chip thin film packaging piece are connected with the connection pads on the back surface of the display panel, so that the display does not need to be bent, and the screen-to-body ratio of the display is improved.

(ZH)
本发明公开一种显示器结构及制造方法。所述显示器结构包含一基板、一显示器元件层、一绝缘保护层、多条显示信号线、多个第一连接垫及一覆晶薄膜封装件;所述第一连接垫设置在基板背面上,并与所述多条显示信号线相连接;所述覆晶薄膜封装件具有多个第二连接垫,与所述多个第一连接垫电性连接。本发明通过将覆晶薄膜封装件上的连接垫与显示面板背面的连接垫相连接,以达到不用弯折显示器,从而提高显示器的屏占比。

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