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1. CN109599477 - Method for manufacturing mesh

Office China
Application Number 201811437607.0
Application Date 28.11.2018
Publication Number 109599477
Publication Date 09.04.2019
Grant Number 109599477
Grant Date 02.06.2020
Publication Kind B
IPC
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 27/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
CPC
H01L 27/156
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
153in a repetitive configuration, e.g. LED bars
156two-dimensional arrays
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
H01L 2933/0066
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0066relating to arrangements for conducting electric current to or from the semiconductor body
Applicants WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
武汉华星光电技术有限公司
Inventors ZHANG GUIYANG
张桂洋
Agents 深圳市德力知识产权代理事务所 44265
Title
(EN) Method for manufacturing mesh
(ZH) 网孔的制作方法
Abstract
(EN)
The invention provides a method for manufacturing a mesh. The method comprises the following steps: arranging a plurality of first portions extending in the horizontal direction and parallel to each other, and a plurality of second portions extending in the vertical direction and parallel to each other, wherein the first and second portions are respectively made of one of a magnet and a magnetic material; adjusting the positions of the plurality of first portions and the plurality of second portions according to the position of the preset opening region to stagger mutually to form a pluralityof opening regions, so as to dynamically adjusting the position of the opening region, and realize the arrangement mode that one mesh corresponds a plurality of LEDs, which is the one-to-many relationship, thereby improving the applicability of the mesh, greatly reducing the production cost, an having the characteristics of energy saving and environmental protection with no waste and exhaust gas generated during the production.

(ZH)
本发明提供一种网孔的制作方法。该网孔的制作方法通过沿水平方向延伸且相互平行的多个第一部以及沿垂直方向延伸且相互平行的多个第二部;所述第一部与第二部的材料分别为磁体和磁性材料中的一种,根据预设的开口区的位置调节所述多个第一部与多个第二部的位置以相互交错形成多个开口区,实现动态调节开口区的位置,实现一张网孔对应多种LED排列方式,即网孔与LED排列方式是“一对多”的关系,提高网孔的适用性,极大的降低生产成本,并且制作过程无废料和废气产生,具有节能环保的特性。

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