Processing

Please wait...

Settings

Settings

Goto Application

1. CN109482750 - Rivet-free micro-riveting device

Office
China
Application Number 201811583739.4
Application Date 24.12.2018
Publication Number 109482750
Publication Date 19.03.2019
Publication Kind A
IPC
B21D 39/03
BPERFORMING OPERATIONS; TRANSPORTING
21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
39Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
03of sheet metal otherwise than by folding
B21D 37/16
BPERFORMING OPERATIONS; TRANSPORTING
21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
37Tools as parts of machines covered by this subclass
16Heating or cooling
CPC
B21D 37/16
BPERFORMING OPERATIONS; TRANSPORTING
21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
37Tools as parts of machines covered by this subclass
16Heating or cooling
B21D 39/03
BPERFORMING OPERATIONS; TRANSPORTING
21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
39Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating
03of sheet metal otherwise than by folding
Applicants GUANGDONG UNIVERSITY OF TECHNOLOGY
广东工业大学
FOSHAN GEWEI TECHNOLOGY CO., LTD.
佛山市铬维科技有限公司
Inventors GUO ZHONGNING
郭钟宁
HUANG XING
黄兴
CHEN TIENIU
陈铁牛
WANG LIANGLIANG
王亮亮
DENG YU
邓宇
Agents 北京集佳知识产权代理有限公司 11227
Title
(EN) Rivet-free micro-riveting device
(ZH) 一种无铆钉微铆接装置
Abstract
(EN)
The invention discloses a rivet-free micro-riveting device. The rivet-free micro-riveting device comprises a laser emitting system used for emitting laser, a laser transmitting device used for transmitting the laser to a riveting point of a workpiece, and an installation table used for containing the workpiece, wherein the installation table is provided with a water tank used for containing deionized water so as to enable the deionized water to fill the riveting point of the workpiece, and then the deionized water is induced to generate cavitation bubbles when the laser is irradiated to the riveting point; and plasma shock waves generated in the initial stage of cavitation bubble growth and shock waves and jet flow which are generated when the cavitation bubbles are collapsed are guided tothe workpiece, so that the workpiece is subjected to plastic deformation to form a riveting embedding point to complete riveting. According to the rivet-free micro-riveting device, the deionized water is used as a medium, the shock waves of the cavitation bubbles generated by the deionized water in the expanding and collapsing processes are induced by the laser to replace a traditional solid punch to apply the acting force, and two foil plates are riveted together under the micro-scale to realize the connection of micro-foil plate parts of the same kind or different kinds of materials.

(ZH)
本发明公开了一种无铆钉微铆接装置,包括用于发射激光的激光发射系统、用于将激光传导至工件铆接点的激光传导装置、以及用于放置工件的安装台,安装台上设有用于放置去离子水、以使去离子水填充于工件铆接点的水槽,以使激光照射至铆接点时诱导去离子水产生空化泡。将空化泡生长初期产生的等离子体冲击波和空泡溃灭时产生的冲击波及射流导引至工件上,使工件发生塑性变形形成铆接镶嵌点,完成铆接。本发明所提供的无铆钉微铆接装置,以去离子水作为媒介,利用激光诱导去离子水产生的空化泡在膨胀、溃灭过程中的冲击波加载代替传统实体冲头施加作用力,在微尺度下将两块箔板铆接在一起,实现同种或异种材料微型箔板零件的连接。

Related patent documents