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1. CN109496055 - Circuit structure assembly method, device and circuit structure

Office China
Application Number 201710823223.1
Application Date 13.09.2017
Publication Number 109496055
Publication Date 19.03.2019
Publication Kind A
IPC
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
CPC
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H05K 1/0203
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
H05K 3/0005
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0005for designing circuits by computer
H01L 23/42
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
H05K 1/0204
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
Applicants ZTE CORPORATION
中兴通讯股份有限公司
Inventors HUANG ZHULIN
黄竹邻
Agents 北京安信方达知识产权代理有限公司 11262
北京安信方达知识产权代理有限公司 11262
Title
(EN) Circuit structure assembly method, device and circuit structure
(ZH) 一种电路结构件的装配方法、设备及电路结构件
Abstract
(EN)
The invention discloses a circuit structure assembly method, device and a circuit structure. The method comprises steps: an automatic measuring device measures the depth and the path of a channel between at least one chip and a PCB, wherein the at least one chip is arranged on the PCB; an automatic calculating device determines the thickness and the path of a cooling reinforcement material according to the depth and the path of the channel between at least one chip and the PCB and predetermined cooling parameters and configures dispensing parameters and a path for an automatic dispensing device; the automatic dispensing device coats the cooling reinforcement material in the channel between at least one chip and the PCB according to the dispensing parameters and the path configured by the automatic calculating device; and an automatic heating device heats the cooling reinforcement material to a first predetermined temperature, and thus, the cooling reinforcement material infiltrates into the chip and the PCB. Thus, the cooling performance is enhanced on the premise of not occupying the layout area of the PCB.

(ZH)
本文公布了一种电路结构件的装配方法、设备及电路结构件,包括:自动化测量设备测量至少一个芯片与PCB之间沟道的深度和路径,所述至少一个芯片设置在印刷电路板PCB上;自动化计算设备根据所述至少一个芯片与PCB之间沟道的深度和路径、以及预定的散热参数,确定散热加固材料的厚度和路径,为自动化点胶设备配置点胶参数和路径;自动化点胶设备按照所述自动化计算设备配置的点胶参数和路径在所述至少一个芯片与PCB之间的沟道内涂覆所述散热加固材料;自动化加热设备将所述散热加固材料加热至第一预定温度,使得所述散热加固材料渗入所述芯片和PCB。本申请在不占用PCB布局面积的前提下提升了散热性能。

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