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1. (CN109415489) RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

Office : China
Application Number: 201780040121.0 Application Date: 12.05.2017
Publication Number: 109415489 Publication Date: 01.03.2019
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2017018032 ; Publication Number: Click to see the data
IPC:
C08G 59/20
H05K 1/03
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants: MITSUBISHI GAS CHEMICAL CO
三菱瓦斯化学株式会社
Inventors: KITAMURA SHINYA
喜多村慎也
SUZUKI TAKUYA
铃木卓也
SHIKA SEIJI
四家诚司
Agents: 北京林达刘知识产权代理事务所(普通合伙) 11277
北京林达刘知识产权代理事务所(普通合伙) 11277
Priority Data: 2016-128721 29.06.2016 JP
2017-013315 27.01.2017 JP
Title: (EN) RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
(ZH) 树脂组合物、树脂片材、多层印刷布线板及半导体装置
Abstract:
(EN) Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a support body, and a multilayer printed circuit board and a semiconductor device that use said resin composition and said resin sheet with a support body. The resin composition includes a dicyclopentadiene-type epoxy resin (A) expressed by formula (1), a photocuring initiator (B), a compound (C) expressed by formula (2), and a compound (D) that has an ethylenically unsaturated group other than the (C) component.
(ZH) 提供用于多层印刷布线板时,涂膜性和耐热性优异,镀覆密合性、显影性优异的树脂组合物、带支承体的树脂片材、使用了它们的多层印刷布线板、半导体装置。一种树脂组合物,其含有下述式(1)所示的双环戊二烯型环氧树脂(A)、光固化引发剂(B)、下述式(2)所示的化合物(C)和该(C)成分以外的具有烯属不饱和基团的化合物(D)。
Also published as:
KR1020190022517WO/2018/003313