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1. CN109368588 - Chip built-in circuit board, combined sensor and electronic equipment

Office China
Application Number 201811501577.5
Application Date 07.12.2018
Publication Number 109368588
Publication Date 22.02.2019
Publication Kind A
IPC
B81B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
CPC
B81B 7/0064
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
0064for protecting against electromagnetic or electrostatic interferences
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81B 2201/0264
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0264Pressure sensors
Applicants GOERTEK INC.
歌尔股份有限公司
Inventors WANG DEXIN
王德信
QIU WENRUI
邱文瑞
YANG JUNWEI
杨军伟
PAN XINCHAO
潘新超
DUANMU LUYU
端木鲁玉
Agents 深圳市世纪恒程知识产权代理事务所 44287
Title
(EN) Chip built-in circuit board, combined sensor and electronic equipment
(ZH) 芯片内置电路板、组合传感器及电子设备
Abstract
(EN)
The invention discloses a chip built-in circuit board, a combined sensor applying the chip built-in circuit board, and electronic equipment applying the combined sensor. The chip built-in circuit board comprises a matrix circuit board, a first ASIC chip and a second ASIC chip, wherein the first ASIC chip and the second ASIC chip are arranged in the matrix circuit board at intervals; and an anti-inference hole is formed on the matrix circuit board between the first ASIC chip and the second ASIC chip. The technical scheme disclosed by the invention aims at weakening the electromagnetic interference between two adjacent chips in the chip built-in circuit board.

(ZH)
本发明公开一种芯片内置电路板、应用该芯片内置电路板的组合传感器及应用该组合传感器的电子设备。其中,芯片内置电路板包括基体电路板、第一ASIC芯片及第二ASIC芯片,所述第一ASIC芯片和所述第二ASIC芯片间隔地设于所述基体电路板中,所述基体电路板于所述第一ASIC芯片和所述第二ASIC芯片之间开设有抗干扰孔。本发明的技术方案旨在减弱芯片内置电路板中相邻两芯片之间的电磁干扰。

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