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1. (CN108495894) Thermosetting resin composition for sealing, and sheet for sealing

Office : China
Application Number: 201780009296.5 Application Date: 25.01.2017
Publication Number: 108495894 Publication Date: 04.09.2018
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2017002428 ; Publication Number: Click to see the data
IPC:
C08L 63/00
C08K 3/00
C08K 3/26
C08K 3/34
C08L 101/00
H01L 51/50
H05B 33/04
H01L 31/048
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
24
Acids; Salts thereof
26
Carbonates; Bicarbonates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
04
Sealing arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04
adapted as conversion devices
042
including a panel or array of photoelectric cells, e.g. solar cells
048
encapsulated or with housing
CPC:
C08K 3/00
C08K 3/26
C08K 3/34
C08L 63/00
C08L 101/00
H01L 31/048
H01L 51/50
H05B 33/04
Y02E 10/50
Y02P 70/521
Applicants: AJINOMOTO CO., INC.
味之素株式会社
Inventors: KUBO YUKI
久保有希
Agents: 中国专利代理(香港)有限公司 72001
中国专利代理(香港)有限公司 72001
Priority Data: 2016-017028 01.02.2016 JP
Title: (EN) Thermosetting resin composition for sealing, and sheet for sealing
(ZH) 密封用的热固性树脂组合物及密封用片材
Abstract:
(EN) The present invention provides a thermosetting resin composition for sealing, which contains (A) a thermosetting resin, (B) a curing agent and (C) semi-calcined hydrotalcite as an inorganic filler, wherein when the thermogravimetric loss rate prior to moisture absorption, as measured by thermogravimetric analysis, at 280 DEG C of a cured product of the thermosetting resin composition is denoted byX1 (%), the thermogravimetric loss rate prior to moisture absorption of the cured product at 380 DEG C is denoted by Y1 (%), the thermogravimetric loss rate following moisture absorption, as measuredby thermogravimetric analysis, at 280 DEG C of the cured product of the thermosetting resin composition is denoted by X2 (%) and the thermogravimetric loss rate following moisture absorption of the cured product at 380oC is denoted by Y2 (%), the relationships 2% <= X2-X1 and Y2-Y1 <= 10% are satisfied and the overall content of inorganic filler, including semi-calcined hydrotalcite, is 20-60 mass% relative to the overall quantity of non-volatile components in the thermosetting resin composition.
(ZH) 本发明提供一种热固性树脂组合物,其是包含(A)热固性树脂、(B)固化剂、及作为无机填充剂的(C)半煅烧水滑石的密封用的热固性树脂组合物,其中,将吸湿前的该热固性树脂组合物的固化物的通过热重分析测得的280℃时的热失重率设为X1(%)、380℃时的热失重率设为Y1(%);将吸湿后的该热固性树脂组合物的固化物的通过热重分析测得的280℃时的热失重率设为X2(%)、380℃时的热失重率设为Y2(%)时,满足2%≤X2‑X1且Y2‑Y1≤10%的关系,相对于热固性树脂组合物的全部不挥发成分,包含半煅烧水滑石的无机填充剂整体的含量为20~60质量%。
Also published as:
KR1020180104319WO/2017/135112