PATENTSCOPE will be unavailable a few hours for maintenance reason on Monday 03.02.2020 at 10:00 AM CET
Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (CN108369945) INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGURATION

Office : China
Application Number: 201680070641.1 Application Date: 21.10.2016
Publication Number: 108369945 Publication Date: 03.08.2018
Publication Kind : A
Prior PCT appl.: Application Number:PCTUS2016058068 ; Publication Number: Click to see the data
IPC:
H01L 25/16
H01L 25/065
H01L 25/11
H01L 25/00
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
11
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
CPC:
G02B 6/4204
G02B 6/4246
G02B 6/428
H01L 24/13
H01L 24/16
H01L 24/20
H01L 24/48
H01L 25/167
H01L 2224/0401
H01L 2224/04105
H01L 2224/12105
H01L 2224/131
H01L 2224/16227
H01L 2224/48227
H01L 2224/73267
H01L 2924/10253
H01L 2924/14
H01L 2924/1431
H01L 2924/1433
H01L 2924/1434
H01L 2924/15192
H01L 2924/15321
H01L 27/14618
H01L 25/50
H04B 10/40
Applicants: INTEL CORPORATION
英特尔公司
Inventors: DOSUNMU OLUFEMI I.
O.I.多孙姆
YIM MYUNG JIN
M.J.严
LIU ANSHENG
A.刘
Agents: 中国专利代理(香港)有限公司 72001
中国专利代理(香港)有限公司 72001
Priority Data: 14/956191 01.12.2015 US
Title: (EN) INTEGRATED CIRCUIT WITH CHIP-ON-CHIP AND CHIP-ON-SUBSTRATE CONFIGURATION
(ZH) 具有芯片上芯片和衬底上芯片配置的集成电路
Abstract: front page image
(EN) Embodiments of the present disclosure provide an apparatus comprising an integrated circuit with a chip-on-chip and chip-on-substrate configuration. In one instance, apparatus may include optical transceiver with opto-electronic component disposed in a first portion of a die, and a trace coupled with opto-electronic component and disposed to extend substantially to a surface in a second portion ofthe die adjacent to first portion, to provide electrical connection for the integrated circuit and another integrated circuit to be coupled with second portion of the die in chip-on-chip configuration. The apparatus may include a second trace disposed in second portion of the die to extend substantially to surface in second portion, to provide electrical connection for other integrated circuit and a substrate to be coupled with second portion of the die in chip-on-substrate configuration. Other embodiments may be described and/or claimed.
(ZH) 本公开的实施例提供一种包括具有芯片上芯片和衬底上芯片配置的集成电路的装置。在一个示例中,装置可包含具有放置在晶片的第一部分中的光电子部件的光收发器、以及迹线,该迹线与光电子部件耦合,并且放置成大体上延伸到邻近于第一部分的晶片的第二部分中的表面,来为集成电路和另一集成电路提供电连接,该另一集成电路将要采用芯片上芯片配置与晶片的第二部分耦合。装置可包含第二迹线,该第二迹线在晶片的第二部分中放置成大体上延伸到第二部分中的表面,来为另一集成电路和衬底提供电连接,该衬底将要采用衬底上芯片配置与晶片的第二部分耦合。可描述和/或要求保护其他实施例。
Also published as:
DE112016005492WO/2017/095548