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1. (CN108352363) WIRING SUBSTRATE, OPTICAL SEMICONDUCTOR ELEMENT PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE

Office : China
Application Number: 201780003686.1 Application Date: 26.01.2017
Publication Number: 108352363 Publication Date: 31.07.2018
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2017002745 ; Publication Number: Click to see the data
IPC:
H01L 23/02
H01L 23/04
H01L 23/12
H01L 31/02
H01S 5/022
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
CPC:
H01L 23/047
H01L 23/053
H01L 23/057
H01L 2224/48091
H05K 1/0219
H05K 1/0227
H05K 1/024
H05K 1/0243
H05K 1/0253
H05K 2201/0191
H05K 2201/09036
H05K 2201/09236
H05K 2201/093
H05K 2201/09845
H05K 2201/10121
H05K 2203/1131
H01L 23/12
H01L 31/02
H01S 5/022
H01S 5/02212
H01S 5/02276
H05K 1/0245
H05K 1/0306
H05K 3/1216
H05K 2201/068
H05K 2201/09154
H05K 2201/10287
H05K 2201/10424
Applicants: KYOCERA CORPORATION
京瓷株式会社
Inventors: KITAMURA TOSHIHIKO
北村俊彦
Agents: 中科专利商标代理有限责任公司 11021
Priority Data: 2016-012943 27.01.2016 JP
Title: (EN) WIRING SUBSTRATE, OPTICAL SEMICONDUCTOR ELEMENT PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE
(ZH) 布线基板、光半导体元件封装体以及光半导体装置
Abstract: front page image
(EN) This wiring substrate has signal conductor wiring positioned on a first surface of a first dielectric layer, and has a ground conductor layer positioned on a second surface thereof. When seen from a planar view, the ground conductor layer region where a first end section of the signal conductor wiring is positioned is notched inward from a first side of the second surface that corresponds to a first side of the first surface.
(ZH) 布线基板中,信号导体布线位于第1电介质层的第1面,接地导体层位于第2面。在接地导体层中,俯视下,信号导体布线的第1端部所处的区域从与第1面的第1边对置的第2面的第1边侧向内向侧被切去。
Also published as:
US20180352648EP3410471WO/2017/131092