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1. (CN108353500) SUBSTRATE DEVICE AND METHOD FOR PRODUCING SUBSTRATE DEVICE

Office : China
Application Number: 201680066405.2 Application Date: 11.11.2016
Publication Number: 108353500 Publication Date: 31.07.2018
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2016083476 ; Publication Number: Click to see the data
IPC:
H05K 1/14
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
CPC:
H01L 24/11
H01L 24/13
H01L 24/16
H01L 2224/1132
H01L 2224/131
H01L 2224/16227
H01L 2224/81192
H05K 1/14
H05K 1/144
H05K 3/368
H05K 3/4015
H05K 2201/047
H05K 2201/10454
H05K 2201/10568
H05K 2201/2036
H01L 24/97
H01L 2224/16225
H05K 1/11
H05K 1/145
H05K 1/181
H05K 3/4611
H05K 2201/042
H05K 2201/09009
H05K 2201/10734
Applicants: SONY CORPORATION
索尼公司
Inventors: NOMURA YOSHIYUKI
野村祥幸
Agents: 北京康信知识产权代理有限责任公司 11240
北京康信知识产权代理有限责任公司 11240
Priority Data: 2015-231326 27.11.2015 JP
Title: (EN) SUBSTRATE DEVICE AND METHOD FOR PRODUCING SUBSTRATE DEVICE
(ZH) 基板装置及制造基板装置的方法
Abstract: front page image
(EN) The present disclosure pertains to a substrate device and a method for producing the substrate device, capable of improving reliability and the produced quality of the substrate device as electronic hardware. According to the present invention, a plurality of sheet-like substrates in which wiring patterns are formed are stacked on one another to form a single-piece substrate having internal wiring, whereby two substrates are connected both physically and electrically. The disclosure is applicable to a substrate device.
(ZH) 本公开涉及能够提高作为电子装置的基板装置的可靠性和制造质量的基板装置和基板装置的制造方法。根据本发明,层压多个其上形成有布线图案的片状基板,以形成其中形成有内部布线的单一基板,从而两个基板物理和电连接。本公开能够应用于基板装置。
Also published as:
US20180324950WO/2017/090460