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1. CN107710424 - LED PIXEL POINT, LIGHT-EMITTING COMPONENT, LIGHT-EMITTING PANEL AND DISPLAY SCREEN

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China
Application Number 201580081323.0
Application Date 06.08.2015
Publication Number 107710424
Publication Date 16.02.2018
Grant Number 107710424
Grant Date 12.07.2019
Publication Kind B
IPC
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
CPC
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
G09F 2013/222
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
13Illuminated signs; Luminous advertising
20with luminescent surfaces or parts
22electroluminescent
222with LEDs
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
Applicants LIN YI
林谊
Inventors LIN YI
林谊
Agents 北京品源专利代理有限公司 11332
北京品源专利代理有限公司 11332
Title
(EN) LED PIXEL POINT, LIGHT-EMITTING COMPONENT, LIGHT-EMITTING PANEL AND DISPLAY SCREEN
(ZH) LED像素点、发光组件、发光面板和显示屏
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Abstract
(EN) An LED pixel point, comprising a drive IC (20) and an LED chip (40). The LED chip (40) is stacked and mounted on the surface of the drive IC (20), a wire (31) led out from a negative electrode of theLED chip (40) is connected to the drive IC (20), and the drive IC (20) is an unencapsulated bare die. The surface of the bare die is provided with an insulation layer, a bonding pad (30) connected toa positive electrode is provided above the insulation layer, the LED chip (40) is mounted on the bonding pad (30), and the positive electrode of the LED chip (40) is electrically connected to the bonding pad (30). The light transmittance of an LED display product is improved.
(ZH) 一种LED像素点，包括驱动IC(20)和LED芯片(40)；所述LED芯片(40)堆叠安装于所述驱动IC(20)的表面，所述LED芯片(40)的负极引出导线(31)与所述驱动IC(20)相连，所述驱动IC(20)为未封装的裸晶片；所述裸晶片的表面设置有绝缘层，所述绝缘层的上方设置有与正电极相连的焊盘(30)，所述LED芯片(40)安装于所述焊盘(30)上，所述LED芯片(40)的正极与所述焊盘(40)电性连接。提高了LED显示产品的透光率。
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