(EN) An LED pixel point, comprising a drive IC (20) and an LED chip (40). The LED chip (40) is stacked and mounted on the surface of the drive IC (20), a wire (31) led out from a negative electrode of theLED chip (40) is connected to the drive IC (20), and the drive IC (20) is an unencapsulated bare die. The surface of the bare die is provided with an insulation layer, a bonding pad (30) connected toa positive electrode is provided above the insulation layer, the LED chip (40) is mounted on the bonding pad (30), and the positive electrode of the LED chip (40) is electrically connected to the bonding pad (30). The light transmittance of an LED display product is improved.
(ZH) 一种LED像素点,包括驱动IC(20)和LED芯片(40);所述LED芯片(40)堆叠安装于所述驱动IC(20)的表面,所述LED芯片(40)的负极引出导线(31)与所述驱动IC(20)相连,所述驱动IC(20)为未封装的裸晶片;所述裸晶片的表面设置有绝缘层,所述绝缘层的上方设置有与正电极相连的焊盘(30),所述LED芯片(40)安装于所述焊盘(30)上,所述LED芯片(40)的正极与所述焊盘(40)电性连接。提高了LED显示产品的透光率。