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1. CN105074901 - 静电吸盘

Office
China
Application Number 201480017501.9
Application Date 27.03.2014
Publication Number 105074901
Publication Date 18.11.2015
Grant Number 105074901
Grant Date 05.06.2018
Publication Kind B
IPC
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
B23Q 3/15
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL, CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
3Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine
15Devices for holding work using magnetic or electric force acting directly on the work
H02N 13/00
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
13Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
CPC
H01L 21/6833
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6831using electrostatic chucks
6833Details of electrostatic chucks
H01L 21/67109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
67109mainly by convection
H01L 21/6831
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6831using electrostatic chucks
Y10T 279/23
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
279Chucks or sockets
23with magnetic or electrostatic means
Applicants TOTO株式会社
Inventors 穴田和辉
吉井雄一
Agents 北京信慧永光知识产权代理有限责任公司 11290
北京信慧永光知识产权代理有限责任公司 11290
Priority Data 2013-072121 29.03.2013 JP
2013-072122 29.03.2013 JP
2014064870 26.03.2014 JP
Title
(ZH) 静电吸盘
Abstract
(ZH)
本发明所涉及的静电吸盘的特征为,具备:陶瓷电介体基板,具有放置吸附对象物的第1主面、第1主面相反侧的第2主面、从第2主面设置到第1主面的穿通孔;金属制基座板,支撑陶瓷电介体基板且具有与穿通孔连通的气体导入路;及绝缘体塞子,具有设置于气体导入路的陶瓷多孔体、设置在陶瓷多孔体与气体导入路之间的比陶瓷多孔体更致密的陶瓷绝缘膜,陶瓷绝缘膜从陶瓷多孔体的表面进入陶瓷多孔体的内部。对于气体导入路内的放电可得到高的绝缘强度,或者,对于吸附对象物可进行晶片温度均一性高的温度控制。