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1. CN104982099 - 下支撑销的配置确定辅助装置及配置确定辅助方法

Office
China
Application Number 201480006246.8
Application Date 29.01.2014
Publication Number 104982099
Publication Date 14.10.2015
Grant Number 104982099
Grant Date 29.03.2019
Publication Kind B
IPC
H05K 13/04
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
CPC
H05K 13/0061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
H05K 13/08
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
Y10T 29/49119
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49117Conductor or circuit manufacturing
49119Brush
Y10T 29/53174
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53174Means to fasten electrical component to wiring board, base, or substrate
Y10T 29/53191
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
5313Means to assemble electrical device
53191Means to apply vacuum directly to position or hold work part
G06F 30/00
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
30Computer-aided design [CAD]
Applicants 松下知识产权经营株式会社
Inventors 竹原裕起
竹原裕起
横井敬明
横井敬明
Agents 北京市柳沈律师事务所 11105
北京市柳沈律师事务所 11105
Title
(ZH) 下支撑销的配置确定辅助装置及配置确定辅助方法
Abstract
(ZH) 在基板保持部中确定从下面侧下支撑基板(3)的下支撑销组件22的配置时,使输入了下支撑销组件(22)的配置位置的合成图像显示在已安装面的图像上,而且在销配置图像中的下支撑销组件(22)的平面图像中包含轴部(24)的顶部(25)的图像和抵接到基板3的下面进行下支撑的抵接部(25a)的图像,判断下支撑销和已安装零件之间有无干扰发生。