(EN) The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5).
(ZH) 本发明涉及一种具有防腐蚀压焊连接的电子构件(1)和用于制造这种电子构件的方法。为此电子构件(1)在衬底(4)上具有至少一个半导体芯片(3)。此外,在半导体芯片(3)上设有承受腐蚀风险的压焊连接。作为至少一个半导体芯片(3)和至少一个承受腐蚀风险的压焊连接的封装,它们由密闭包封的外壳(5)包围。密闭包封的压焊连接是压焊引线连接(2),它完全地与至少部分的衬底(4)包封在外壳(5)内。衬底(4)在外壳(5)内具有至少一个表面安装的易水解的元件(6)。