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1. (CA2235819) MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME

Office : Canada
Application Number: 2235819 Application Date: 24.10.1996
Publication Number: 2235819 Publication Date: 09.05.1997
Publication Kind : A1
Prior PCT appl.: Application Number:JP1996003100 ; Publication Number: Click to see the data
IPC:
H05K 3/46
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants: SUMITOMO BAKELITE COMPANY LIMITED
Inventors: MITSUI, MASAHIRO
HOSOMI, TAKESHI
NAKAMICHI, SEI
HONJOYA, TOMOYOSHI
KISHI, TOYOAKI
Priority Data: 7/284225 31.10.1995 JP
7/284226 31.10.1995 JP
7/291170 09.11.1995 JP
7/291171 09.11.1995 JP
8/211042 09.08.1996 JP
Title: (EN) MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
(FR) PLAQUETTE DE CIRCUIT IMPRIME MULTICOUCHE ET SON PROCEDE DE FABRICATION
Abstract: front page image
(EN) A multilayer printed circuit board, characterized by being composed of an internal layer circuit board (1) coated with a light and heat curable undercoating agent (3), a copper foil (5) and an insulating adhesive (4) comprising as the main component a brominated bisphenol type epoxy resin or brominated phenoxy resin having a weight average molecular weight of at least 10,000, the copper foil (5) and the insulating adhesive (4) being laminated to one side or both sides of the internal layer circuit board (1) and being integrally cured with the internal layer circuit board (1) and the undercoating agent (3).


Also published as:
SG52014VN3229EP0858725CN1201586KR1019990067192VN3229
WO/1997/016948