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1. (KR1020040103767) CLEANING APPARATUS OF CLEANING CHUCK FOR HOLDING AND TRANSPORTING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS

Office : Republic of Korea
Application Number: 1020040028488 Application Date: 24.04.2004
Publication Number: 1020040103767 Publication Date: 09.12.2004
Grant Number: 1005795360000 Grant Date: 12.05.2006
Publication Kind : B1
IPC:
H01L 21/304
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants: DAINIPPON SCREEN SEIJO K.K
다이닛뽕스크린 세이조오 가부시키가이샤
Inventors: HASEGAWA, KOJI
히로에토시오
HIROE, TOSHIO
요코모토류
YOKOMOTO, RYU
하세가와코지
Agents: 특허법인 원전
Priority Data: JP-P-2003-00121398 25.04.2003 JP
Title: (EN) CLEANING APPARATUS OF CLEANING CHUCK FOR HOLDING AND TRANSPORTING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
(KO) 세정 장치 및 기판 처리 장치
Abstract: front page image
(EN)

PURPOSE: A cleaning apparatus of cleaning a chuck are provided to reduce the amount of injecting gas by improving a throughput and reducing a period for a waterdrop removal process.

CONSTITUTION: A cleaning tank(10) is used for storing a liquid for cleaning a chuck(21) for supporting a substrate. A liquid supply mechanism(13) is used for supplying the liquid to the cleaning tank. An injection nozzle(11) is used for injecting a gas to the chuck in order to remove the liquid adhered to the chuck. A gas supply part(14) is used to supply the gas to the injection nozzle. The electrical resistance of the liquid at the temperature for cleaning the chuck in the cleaning tank is lower than the electrical resistance of pure water at the room temperature.

© KIPO 2005


(KO) 척을 세정하는 세정 장치는 세정조, 분사 노즐, 방출 노즐, 액체 공급 기구와 기체 공급 기구로 제공된다. 액체 공급 기구는 가열기 공급 탱크로부터 공급되는 실온 이하의 순수로 전기 저항이 감소된 온수를 형성하기 위하여 공급 탱크, 가열기와 액체 분배 기구를 가지고 있다. 액체 공급 기구는 액체 분산 기구를 통해 세정조에 형성된 온수를 공급한다. 수직 이동 기구는 반송 암을 아래로 이동시켜 척을 온수에 담가 척을 세정한다. 따라서, 척을 세정하는 세정 장치의 처리량은 향상되고, 소비되는 기체의 양은 감소되며, 세정 성능이 향상된다.