Processing

Please wait...

Settings

Settings

Goto Application

1. JP2007109794 - SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Office Japan
Application Number 2005297672
Application Date 12.10.2005
Publication Number 2007109794
Publication Date 26.04.2007
Grant Number 4986435
Grant Date 11.05.2012
Publication Kind B2
IPC
H01L 23/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
40Mountings or securing means for detachable cooling or heating arrangements
CPC
H01L 23/40
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
H01L 23/4006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
H01L 2023/405
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4037characterised by thermal path or place of attachment of heatsink
405heatsink to package
H01L 2023/4062
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4037characterised by thermal path or place of attachment of heatsink
4062heatsink to or through board or cabinet
H01L 2023/4087
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4075Mechanical elements
4087Mounting accessories, interposers, clamping or screwing parts
H01L 2224/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
Applicants SONY COMPUTER ENTERTAINMENT INC
株式会社ソニー・インタラクティブエンタテインメント
Inventors YAZAWA KAZUAKI
矢澤 和明
Agents 森下 賢樹
村田 雄祐
三木 友由
青木 武司
Title
(EN) SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
(JA) 半導体装置、半導体装置の作成方法
Abstract
(EN)

PROBLEM TO BE SOLVED: To ease fitting of a heat dissipation member to a package substrate.

SOLUTION: A semiconductor chip 36 has a form where, while its circuit surface is being pressed downward to a package substrate 30, heat is dissipated from the upper surface opposite to the circuit surface. A sealing resin layer 32 seals the periphery of the semiconductor chip 36 to expose the upper surface of the semiconductor chip 36. A fixing member 34 is embedded in the sealing resin layer 32 so that a hook 40 formed on its tip end may project from the upper surface of the semiconductor chip 36. A spreader 10 dissipates heat generating from the semiconductor chip 36. The hook 40 of the fixing member 34 is inserted into an introduction groove 12 formed on the side facing the package substrate 30 of the spreader 10, and the spreader 10 is turned by a specified quantity against the package substrate 30. Thus, the hook 40 is led along the introduction groove 12, and the spreader 10 is made to be pressed down to the semiconductor chip 36.

COPYRIGHT: (C)2007,JPO&INPIT

(JA)

【課題】パッケージ基板への放熱部材の取り付けを容易にする。
【解決手段】半導体チップ36は、パッケージ基板30に回路面を下に向けて押し付けられ回路面と反対側の上面から放熱を行う形態を有する。封止樹脂層32は、半導体チップ36の上面が露出するように該半導体チップ36の周囲を封止する。固定部材34は、その先端に形成されたフック40が半導体チップ36の上面よりも突出するように封止樹脂層32に埋め込まれる。スプレッダ10は、半導体チップ36から発せられる熱を放熱する。スプレッダ10のパッケージ基板30に面する側に形成された導入溝12に固定部材34のフック40を挿入し、スプレッダ10をパッケージ基板30に対して所定量回転させると、導入溝12に沿ってフック40が導かれることによって、スプレッダ10が半導体チップ36に押し付けられる。
【選択図】図4

Also published as