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1. WO2020133494 - RESIN COMPOSITION, PREPREG, LAMINATED BOARD, METAL FOIL-CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD

WO/2020/133494RESIN COMPOSITION, PREPREG, LAMINATED BOARD, METAL FOIL-CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
Appl.Date 29.12.2018
Appl.No PCT/CN2018/125814 Applicant SHENGYI TECHNOLOGY CO. , LTD. Pub.Kind A Pub.Lang zh
Inclusion Criteria IC1
PCT application from which the family originated.
Pub.Date 02.07.2020
CN111757911RESIN COMPOSITION, PREPREG, LAMINATED BOARD, METAL FOIL-CLAD LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
Appl.Date 29.12.2018
Appl.No 201880047552.4 Applicant SHENGYI TECHNOLOGY CO LTD Pub.Kind A
Inclusion Criteria IC2
National entry of a PCT application.

If this application is not visible in the National Phase tab of the PCT application, its relationship to the PCT application is identified from the PCT or regional filing or publication information of its bibliographic data.

Pub.Date 09.10.2020