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1. WO2020135498 - METHOD AND APPARATUS FOR FINAL POLISHING OF SILICON WAFER

CN109648451Silicon wafer final polishing method and device
Appl.Date 29.12.2018
Appl.No 201811636945.7 Applicant XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD. Pub.Kind A,B
Inclusion Criteria IC5
Sole priority inside the family.
Pub.Date 19.04.2019
WO/2020/135498METHOD AND APPARATUS FOR FINAL POLISHING OF SILICON WAFER
Appl.Date 25.12.2019
Appl.No PCT/CN2019/128276 Applicant XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD. Pub.Kind A Pub.Lang zh
Inclusion Criteria IC1
PCT application from which the family originated.
Pub.Date 02.07.2020
US20210296133METHOD AND APPARATUS FOR FINAL POLISHING OF SILICON WAFER
Appl.Date 25.12.2019
Appl.No 17264514 Applicant XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD Pub.Kind A1
Inclusion Criteria IC2
National entry of a PCT application.

If this application is not visible in the National Phase tab of the PCT application, its relationship to the PCT application is identified from the PCT or regional filing or publication information of its bibliographic data.

Pub.Date 23.09.2021