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1. US20090020733 - CONDUCTIVE PASTE

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Claims

1. A conductive paste that includes a binder containing a thermosetting resin and conductive particles,
wherein the lowest exothermic peak temperature T 1 (degrees C.) among at least one exothermic peak of the binder obtained by differential scanning calorimetry and the lowest endothermic peak temperature t 1 (degrees C.) among at least one endothermic peak of the conductive particles obtained by differential scanning calorimetry satisfy Equation (1)

           t 1−20< T  (1).
2. The conductive paste according to claim 1, wherein
the conductive particles preferably have at least one exothermic peak by differential scanning calorimetry.
3. The conductive paste according to claim 2, wherein
the conductive particles preferably have alloy particles (I) that have at least one exothermic peak by differential scanning calorimetry and alloy particles (II) that have an endothermic peak at the endothermic peak temperature t 1.
4. The conductive paste according to claim 1, wherein
the conductive paste contains 0.1 to 4.0 parts by weight of an oxide film remover relative to 100 parts by weight of the conductive particles.
5. The conductive paste according to claim 2, wherein
the conductive paste contains 0.1 to 4.0 parts by weight of an oxide film remover relative to 100 parts by weight of the conductive particles.
6. The conductive paste according to claim 3, wherein
the conductive paste contains 0.1 to 4.0 parts by weight of an oxide film remover relative to 100 parts by weight of the conductive particles.
7. The conductive paste according to any one of claims 1 through 6, wherein
the conductive paste is suitable for filling via holes in a printed circuit board.