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1. WO2020141286 - METHOD FOR COLLECTIVELY BENDING A SET OF ELECTRONIC CHIPS

Publication Number WO/2020/141286
Publication Date 09.07.2020
International Application No. PCT/FR2020/050005
International Filing Date 03.01.2020
IPC
H01L 27/146 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
CPC
H01L 27/14601
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
H01L 27/14618
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14618Containers
H01L 27/14632
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14632Wafer-level processed structures
H01L 27/14687
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
14687Wafer level processing
Applicants
  • COMMISSARIAT A L'ÉNERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES [FR]/[FR]
Inventors
  • CHAMBION, Bertrand
  • COLONNA, Jean-Philippe
Agents
  • PINOT, Christophe
Priority Data
190009904.01.2019FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) METHOD FOR COLLECTIVELY BENDING A SET OF ELECTRONIC CHIPS
(FR) PROCEDE DE MISE EN COURBURE COLLECTIVE D'UN ENSEMBLE DE PUCES ELECTRONIQUES
Abstract
(EN)
This method comprising the steps: a) providing the set of electronic chips (P), comprising: - a stack comprising: a first layer (1), having opposing first and second surfaces (10, 11), a set of pixel matrices (2) formed on the first surface (10); the stack having a first thickness and a first CTE; - a material (4) having a second thickness, a second CTE strictly greater than the first CTE, and a shaping temperature, the material (4) being shaped on the stack so as to match the contour of the pixel matrices (2); b) cutting the electronic chips (P); the shaping temperature, the ratio between the first and second CTEs and the ratio between the first and second thicknesses being adapted so that, when step b) is completed, the stack is curved, adopting a predetermined concave shape, oriented toward the material (4), at a given working temperature of the electronic chip (P).
(FR)
Procédé de mise en courbure collective d'un ensemble de puces électroniques Ce procédé comporte les étapes : a) prévoir l'ensemble de puces électroniques (P), comportant : - un empilement comprenant : une première couche (1), comprenant des première et seconde surfaces (10, 11) opposées, un ensemble de matrices de pixels (2), formé à la première surface (10); l'empilement possédant une première épaisseur et un premier CTE; - un matériau (4), possédant une seconde épaisseur, un second CTE strictement supérieur au premier CTE, et une température de formation, le matériau (4) étant formé sur l'empilement de manière à épouser le contour des matrices de pixels (2); b) découper les puces électroniques (P); la température de formation, le ratio entre les premier et second CTE et le ratio entre les première et seconde épaisseurs étant adaptés de sorte qu'à l'issue de l'étape b), l'empilement est incurvé selon une forme concave prédéterminée, orientée vers le matériau (4), à une température de fonctionnement donnée de la puce électronique (P).
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