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1. CN101370838 - Phenol resin and resin compositions

Office
China
Application Number 200780002946.X
Application Date 24.01.2007
Publication Number 101370838
Publication Date 18.02.2009
Publication Kind A
IPC
C08G 8/28
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Condensation polymers of aldehydes or ketones with phenols only
28Chemically modified polycondensates
CPC
C08G 8/28
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
8Condensation polymers of aldehydes or ketones with phenols only
28Chemically modified polycondensates
C08G 59/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
02Polycondensates containing more than one epoxy group per molecule
04of polyhydroxy compounds with epihalohydrins or precursors thereof
06of polyhydric phenols
08from phenol-aldehyde condensates
Applicants Hitachi Chemical Company Ltd.
日立化成工业株式会社
Inventors Sue Haruaki
陶晴昭
Satou Kuniaki
佐东国昭
Matsuzaka Osamu
松坂治
Agents wang huimin
中科专利商标代理有限责任公司
Priority Data 016212/2006 25.01.2006 JP
Title
(EN) Phenol resin and resin compositions
(ZH) 酚醛树脂及树脂组合物
Abstract
(EN)
The invention provides a phenol resin having the structure represented by formula (1) in the backbone skeleton as a constituent unit and resin compositions containing the same. The phenol resin can easily be epoxidized, chemically modified, or reacted with epoxy resin or the like. According to the invention, various phenol resins from a low-molecular one rich in fluidity to a high-softening one can be synthesized, which is industrially useful. When the phenol resin is used as a curing agent for epoxy resin or the like, the resulting resin composition can give a cured article having a high Tg without impairing the adhesiveness.

(ZH)

本发明提供主链骨架具有下述通式(I)所示结构作为结构单元的酚醛树脂及使用其的树脂组合物。通过本发明的酚醛树脂,环氧化、化学修饰、与环氧树脂的反应等变得容易。另外,能够合成富于流动性的低分子量物质~高软化点的物质,工业上有用。另外,使用本发明的酚醛树脂作为环氧树脂等固化剂时,该树脂组合物不会损害粘接性,可以获得高Tg的固化物。