Processing

Please wait...

Settings

Settings

Goto Application

1. CN113227770 - 半导体晶片的评价方法和制造方法以及半导体晶片的制造工序管理方法

Office
China
Application Number 201980086184.9
Application Date 11.11.2019
Publication Number 113227770
Publication Date 06.08.2021
Publication Kind A
IPC
G01N 21/956
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws, defects or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
H01L 21/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
G01N 21/956
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
956Inspecting patterns on the surface of objects
Applicants 胜高股份有限公司
Inventors 长泽崇裕
村上雅大
Agents 中国专利代理(香港)有限公司 72001
中国专利代理(香港)有限公司 72001
Priority Data 2018245448 27.12.2018 JP
Title
(ZH) 半导体晶片的评价方法和制造方法以及半导体晶片的制造工序管理方法
Abstract
(ZH)
提供了半导体晶片的评价方法,其是具有研磨面的半导体晶片的评价方法,包含利用一种以上洗净液对上述半导体晶片进行洗净的洗净工序,包含:在上述洗净工序之前和之后分别使用激光表面检查装置来测定上述研磨面的LPD,基于通过上述测定得到的测定结果,根据表A所示的判别基准,来判别作为LPD被测定到的缺陷或异物的种类。表A:测定结果缺陷或异物的种类上述洗净工序之前的检测尺寸X和上述洗净工序之后的检测尺寸Y满足X<Y的关系的LPDPID在上述洗净工序之前被检测到但是在上述洗净工序之后未被检测到的LPD通常颗粒上述洗净工序之前的检测尺寸X和上述洗净工序之后的检测尺寸Y满足X≥Y的关系的LPD粘附颗粒