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1. WO2020133732 - PACKAGING METHOD AND PACKAGING STRUCTURE

CN111362228Packaging method and packaging structure
Appl.Date 25.12.2018
Appl.No 201811595035.9 Applicant SMIC INTEGRATED CIRCUIT (NINGBO) CO., LTD. Pub.Kind A
Inclusion Criteria IC5
Sole priority inside the family.
Pub.Date 03.07.2020
WO/2020/133732PACKAGING METHOD AND PACKAGING STRUCTURE
Appl.Date 18.03.2019
Appl.No PCT/CN2019/078541 Applicant NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION Pub.Kind A Pub.Lang zh
Inclusion Criteria IC1
PCT application from which the family originated.
Pub.Date 02.07.2020
KR1020210076953패키징 방법 및 패키징 구조
Appl.Date 18.03.2019
Appl.No 1020217014491 Applicant 닝보 세미컨덕터 인터내셔널 코포레이션 Pub.Kind A
Inclusion Criteria IC2
National entry of a PCT application.

If this application is not visible in the National Phase tab of the PCT application, its relationship to the PCT application is identified from the PCT or regional filing or publication information of its bibliographic data.

Pub.Date 24.06.2021
US20200198964PACKAGING METHOD AND PACKAGING STRUCTURE
Appl.Date 04.12.2019
Appl.No 16702800 Applicant Ningbo Semiconductor International Corporation Pub.Kind A1
Inclusion Criteria IC6
Connected by priority field.
Pub.Date 25.06.2020
JP2021515586
Appl.Date 19.03.2021
Appl.No 2021515586
Inclusion Criteria IC3
National entry of a PCT application not found in PATENTSCOPE.