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1. WO2020134722 - FLIP-CHIP ASSEMBLY, FLIP-CHIP PACKAGING STRUCTURE, AND MANUFACTURING METHOD

CN111384017Flip chip assembly, flip chip packaging structure and preparation method
Appl.Date 29.12.2018
Appl.No 201811638810.4 Applicant CHIPMORE TECHNOLOGY CORPORATION LIMITED Pub.Kind A
Inclusion Criteria IC5
Sole priority inside the family.
Pub.Date 07.07.2020
WO/2020/134722FLIP-CHIP ASSEMBLY, FLIP-CHIP PACKAGING STRUCTURE, AND MANUFACTURING METHOD
Appl.Date 19.11.2019
Appl.No PCT/CN2019/119478 Applicant CHIPMORE TECHNOLOGY CORPORATION LIMITED Pub.Kind A Pub.Lang zh
Inclusion Criteria IC1
PCT application from which the family originated.
Pub.Date 02.07.2020