Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Tuesday 26.10.2021 at 12:00 PM CEST
Settings

Settings

Goto Application

1. WO2021204050 - SEMICONDUCTOR PROCESSING DEVICE

Publication Number WO/2021/204050
Publication Date 14.10.2021
International Application No. PCT/CN2021/084860
International Filing Date 01.04.2021
IPC
H01L 21/67 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
C23C 16/54 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44characterised by the method of coating
54Apparatus specially adapted for continuous coating
Applicants
  • 北京北方华创微电子装备有限公司 BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. [CN]/[CN]
Inventors
  • 魏景峰 WEI, Jingfeng
  • 佘清 SHE, Qing
Agents
  • 北京天昊联合知识产权代理有限公司 TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS
Priority Data
202020527685.610.04.2020CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) SEMICONDUCTOR PROCESSING DEVICE
(FR) DISPOSITIF DE TRAITEMENT DE SEMI-CONDUCTEUR
(ZH) 一种半导体加工设备
Abstract
(EN)
A semiconductor processing device, used for processing a wafer. The semiconductor processing device comprises: a vacuum interlocking chamber (100); a plurality of device bodies (200), each device body (200) comprising a transfer platform (210) and at least two reaction chambers (220) arranged in the circumferential direction of the transfer platform (210); and a temporary storage channel (300), any two adjacent device bodies (200) being communicated by means of the temporary storage channel (300), and the temporary storage channel (300) being used for temporarily storing wafers. One of the plurality of device bodies (200) is connected to the vacuum interlocking chamber (100), and the transfer platform (210) may transfer wafers between the vacuum interlocking chamber (100) and the reaction chambers (220), between the temporary storage channel (300) and the vacuum interlocking chamber (100), and between the temporary storage channel (300) and the reaction chambers (220). The solution solves the problem of low productivity of a semiconductor processing device.
(FR)
L'invention concerne un dispositif de traitement de semi-conducteur, utilisé pour traiter une tranche. Le dispositif de traitement de semi-conducteur comprend : une chambre de verrouillage sous vide (100) ; une pluralité de corps de dispositif (200), chaque corps de dispositif (200) comprenant une plateforme de transfert (210) et au moins deux chambres de réaction (220) disposées dans la direction circonférentielle de la plateforme de transfert (210) ; et un canal de stockage temporaire (300), chaque deux corps de dispositif adjacents (200) étant en communication au moyen du canal de stockage temporaire (300), et le canal de stockage temporaire (300) étant utilisé pour stocker temporairement des tranches. L'un de la pluralité de corps de dispositif (200) est relié à la chambre de verrouillage sous vide (100), et la plateforme de transfert (210) peut transférer des tranches entre la chambre de verrouillage sous vide (100) et les chambres de réaction (220), entre le canal de stockage temporaire (300) et la chambre de verrouillage sous vide (100), et entre le canal de stockage temporaire (300) et les chambres de réaction (220). La solution résout le problème de faible productivité d'un dispositif de traitement de semi-conducteur.
(ZH)
一种半导体加工设备,用于对晶圆进行加工,半导体加工设备包括:真空互锁腔室(100);多个设备主体(200),设备主体(200)包括传输平台(210),在传输平台(210)的周向上排布有至少两个反应腔室(220);暂存通道(300),任意相邻的两个设备主体(200)通过暂存通道(300)相连通,暂存通道(300)用于暂存晶圆;多个设备主体(200)中的一者与真空互锁腔室(100)相连,传输平台(210)可在真空互锁腔室(100)与反应腔室(220)之间、暂存通道(300)与真空互锁腔室(100)之间以及暂存通道(300)与反应腔室(220)之间传送晶圆。上述方案能够解决半导体加工设备产能较低的问题。
Related patent documents
Latest bibliographic data on file with the International Bureau