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1. CN1771352 - Electroless gold plating liquid

Office
China
Application Number 200580000231.1
Application Date 29.03.2005
Publication Number 1771352
Publication Date 10.05.2006
Grant Number 100480425
Grant Date 22.04.2009
Publication Kind C
IPC
C23C 18/44
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
42Coating with noble metals
44using reducing agents
CPC
C23C 18/44
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
42Coating with noble metals
44using reducing agents
C23C 18/168
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1675Process conditions
168Control of temperature, e.g. temperature of bath, substrate
C23C 18/1683
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1675Process conditions
1683Control of electrolyte composition, e.g. measurement, adjustment
Applicants Nikko Materials Co., Ltd.
日矿金属株式会社
Inventors Hino Eiji
日野英治
Kumagai Masashi
熊谷正志
Agents duan chengen tian xin
北京市中咨律师事务所
北京市中咨律师事务所
Priority Data 110630/2004 05.04.2004 JP
Title
(EN) Electroless gold plating liquid
(ZH) 化学镀金液
Abstract
(EN)
Disclosed is an electroless gold plating liquid with excellent stability which has a practically sufficient deposition rate without containing heavy metal ions such as thallium ions. Specifically disclosed is an electroless gold plating liquid characterized by containing a noncyanic gold salt as a gold salt, an alkali metal salt or ammonium salt of sulfurous acid and thiosulfuric acid as a complexing agent for gold, a hydroxyalkyl sulfonic acid represented by the general formula below or a salt thereof as a reducing agent, and an amine compound. Formula (In the above formula, R represents a hydrogen, a carboxy group, an optionally substituted phenyl group, a tolyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group or a furyl group; X represents a hydrogen, Na, K or NH4, and n represents an integer of 0-4.

(ZH)

本发明的目的在于提供一种化学镀金液,其即使不含有铊等重金属离子、也具有在实用上充分的析出速度,另外还具有优异的镀敷液稳定性。该化学镀金液的特征在于,含有非氰化物系金盐作为金盐、亚硫酸和硫代硫酸的碱金属盐或铵盐作为金的络合剂、下述通式所示的羟基烷基磺酸或其盐作为还原剂、胺化合物,(上式中,R表示氢、羧基、或可具有取代基的苯基、甲苯基、萘基、饱和或不饱和的烷基、乙酰基、丙酮基、吡啶基和呋喃基中的任一种,X表示氢、Na、K和NH4中的任一种,n为0~4的整数)。

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