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1. WO2020141331 - IMPROVEMENTS IN OR RELATING TO FLEXIBLE ELECTRONICS

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

CLAIMS

1 A method of manufacturing an electronic assembly, the process comprising the steps of: providing a substrate; printing an adhesive pattern onto a surface of the substrate, the adhesive pattern corresponding to one or more desired conductive tracks; pressing conductive foil onto the adhesive pattern; curing the adhesive such that the foil adheres to the adhesive pattern; removing the non-adhered foil; and folding the substrate after removal of the foil.

2 A method as claimed in claim 1 wherein printing is achieved by inkjet printing.

3. A method as claimed in claim 1 or claim 2 wherein the curing is achieved by low energy electron beam curing.

4. A method as claimed in any preceding claim wherein the substrate comprises a non-conductive material.

5. A method as claimed in any preceding claim wherein a series of separate conductive traces are printed on the same substrate and the method includes the step of cutting the substrate to separate conductive traces.

6 A method as claimed in any preceding claim wherein the method includes the step of printing one or more additional adhesive patterns onto a surface of the substrate or onto the foil after initial foil removal.

7. A method as claimed in claim 7 wherein if the adhesive pattern corresponds to one or more desired conductive tracks, the method includes the steps of pressing conductive foil onto the adhesive pattern such that the foil adheres to the adhesive pattern; and removing the non-adhered foil.

8 A method as claimed in any preceding claim wherein the method includes the step of printing adhesive and subsequently applying and removing foil on both sides of the substrate.

9. A method as claimed in any preceding claim wherein the method includes the step of making multiple folds of the substrate.

10 A method as claimed in any preceding claim wherein the method includes the step of applying an additional adhesive pattern before folding the substrate.

11. A method as claimed in any preceding claim wherein the method includes the stacking together of one or more substrates with conductive tracks.

12. A method as claimed in any preceding claim wherein the method includes the step of mounting one or more integrated circuits on the substrate.

13. A method as claimed in any preceding claim wherein the method includes the additional step of providing a protective layer over the substrate surface to which the foil is affixed.

14. A method as claimed in claim 13 wherein the protective layer is adapted to retain folded portions of the substrate in the appropriate position

15. An apparatus for manufacturing an electronic assembly, the apparatus comprising: a printing unit operable to apply an adhesive pattern onto a surface of the substrate, the adhesive pattern corresponding to one or more desired conductive tracks; a foil applicator operable to press conductive foil onto the adhesive pattern; an adhesive curing unit operable to cure the applied adhesive such that the foil adheres to the adhesive pattern; a foil de-applicator operable to remove the non-adhered foil; and means for folding the substrate after removal of the foil.

16. An apparatus as claimed in claim 15 wherein the adhesive curing unit comprises a low energy electron beam source.

17. An electronic assembly, the component comprising: a substrate; an adhesive pattern applied on at least one surface of the substrate, the adhesive pattern corresponding to one or more desired conductive tracks; a conductive foil adhered on top of the adhesive pattern; and wherein the assembly comprises a folded substrate.

18. An electronic assembly as claimed in claim 17 wherein the substrate is non- conductive

19. An electronic assembly as claimed in claim 17 or claim 18 wherein the assembly comprises an additional adhesive pattern printed over the substrate and/or foil. 20 An electronic assembly as claimed in claim 19 wherein the assembly includes an additional conductive foil adhered to the additional adhesive pattern.

21 An electronic assembly as claimed in any one of claims 17 to 20 wherein the assembly includes an adhesive pattern and an adhered conductive foil on both sides of the substrate.

22 An electronic assembly as claimed in any one of claims 17 to 21 wherein the substrate comprises multiple folds.

23. An electronic assembly as claimed in any one of claims 17 to 22 wherein the folded substrate is retained in position by the additional adhesive pattern or by additionally applied adhesive.

24. An electronic assembly as claimed in any one of claims 17 to 23 wherein the assembly comprises multiple layers of substrate stacked together.

25. An electronic assembly as claimed in any one of claims 17 to 24 wherein the assembly include one or more additional integrated circuits mounted on the substrate.

26. An electronic assembly as claimed in any one of claims 17 to 25 wherein the assembly comprises a protective layer.

27. An electronic assembly as claimed in claim 26 wherein the protective layer is adapted to retain folded portions of the substrate in the appropriate position. 28. An electronic assembly as claimed in any one of claims 17 to 27 wherein the assembly comprises all or part of any one or more of: an antenna; an RF tag; an NFC tag; an energy scavenging device; a touch sensor; a loudspeaker;

29. An item of packaging incorporating an electronic assembly according to any one of claims 17 to 28.