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1. WO2022012876 - SEMICONDUCTOR CHIP AND SECURITY CIRCUIT ASSEMBLY COMPRISING SUCH A SEMICONDUCTOR CHIP

Publication Number WO/2022/012876
Publication Date 20.01.2022
International Application No. PCT/EP2021/066859
International Filing Date 21.06.2021
IPC
H02H 7/08 2006.1
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
7Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
08for dynamo-electric motors
B62D 5/04 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
62LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
DMOTOR VEHICLES; TRAILERS
5Power-assisted or power-driven steering
04electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
H02H 3/20 2006.1
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
3Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection
20responsive to excess voltage
G05B 9/02 2006.1
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
9Safety arrangements
02electric
B25J 9/16 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
9Programme-controlled manipulators
16Programme controls
G05B 19/048 2006.1
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
19Programme-control systems
02electric
04Programme control other than numerical control, i.e. in sequence controllers or logic controllers
048Monitoring; Safety
CPC
G06F 11/0736
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
11Error detection; Error correction; Monitoring
07Responding to the occurrence of a fault, e.g. fault tolerance
0703Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation
0706the processing taking place on a specific hardware platform or in a specific software environment
0736in functional embedded systems, i.e. in a data processing system designed as a combination of hardware and software dedicated to performing a certain function
G06F 11/0757
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
11Error detection; Error correction; Monitoring
07Responding to the occurrence of a fault, e.g. fault tolerance
0703Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation
0751Error or fault detection not based on redundancy
0754by exceeding limits
0757by exceeding a time limit, i.e. time-out, e.g. watchdogs
G06F 11/3013
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
11Error detection; Error correction; Monitoring
30Monitoring
3003Monitoring arrangements specially adapted to the computing system or computing system component being monitored
3013where the computing system is an embedded system, i.e. a combination of hardware and software dedicated to perform a certain function in mobile devices, printers, automotive or aircraft systems
G06F 11/3058
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
11Error detection; Error correction; Monitoring
30Monitoring
3058Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
H03K 17/18
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
KPULSE TECHNIQUE
17Electronic switching or gating, i.e. not by contact-making and –breaking
18Modifications for indicating state of switch
Applicants
  • VITESCO TECHNOLOGIES GMBH [DE]/[DE]
Inventors
  • WUNDERLICH, Andreas
  • FISCH, Alfons
  • BAVOIS, Thierry
  • LABERER, Franz
Priority Data
10 2020 208 854.315.07.2020DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) HALBLEITERCHIP UND SICHERHEITSSCHALTUNGSANORDNUNG MIT EINEM SOLCHEN HALBLEITERCHIP
(EN) SEMICONDUCTOR CHIP AND SECURITY CIRCUIT ASSEMBLY COMPRISING SUCH A SEMICONDUCTOR CHIP
(FR) PUCE SEMI-CONDUCTRICE ET ENSEMBLE DE CIRCUITS DE SÉCURITÉ COMPRENANT UNE TELLE PUCE SEMI-CONDUCTRICE
Abstract
(DE) Die Erfindung betrifft einen Halbleiterchip (1) mit darauf schaltungstechnisch realisierten Funktionen, der einen ersten Bereich (2) aufweist, in dem eine erste Gruppe von sicherheitsrelevanten Grundfunktionen (3) schaltungstechnisch realisiert ist und der einen zweiten Bereich (4) aufweist, der von dem ersten Bereich (2) durch technologische Sicherheitsmaßnahmen getrennt ist, in dem eine die Grundfunktionen überwachende erste Gruppe von Überwachungsfunktionen (5) schaltungstechnisch realisiert ist. Er weist außerdem einen dritten, auf dem Halbleiterchip (1) ausgebildeten Bereich (6) auf, der von den anderen Bereichen (2, 3) durch technologische Sicherheitsmaßnahmen getrennt ist, in dem eine die Grundfunktionen überwachende zweite Gruppe von Überwachungsfunktionen (7) schaltungstechnisch realisiert ist.
(EN) The invention relates to a semiconductor chip (1) with functions that are implemented thereon in the circuitry, having a first region (2), in which a first group of security-relevant base functions (3) are implemented in the circuitry, and a second region (4), which is separated from the first region (2) using technological security measures and in which a first group of monitoring functions (5) are implemented in the circuitry that monitor the base functions. The semiconductor chip additionally has a third region (6), which is formed on the semiconductor chip (1) and is separated from the other regions (2, 3) using technological security measures and in which a second group of monitoring functions (7) are implemented in the circuitry, said monitoring functions monitoring the base functions.
(FR) L’invention porte sur une puce semi-conductrice (1) sur laquelle des fonctions sont mises en œuvre dans les circuits, ayant une première zone (2), dans laquelle un premier groupe de fonctions de base (3) associées à la sécurité sont mises en œuvre dans les circuits, et une deuxième zone (4), qui est séparée de la première zone (2) au moyen de mesures de sécurité technologiques et dans laquelle un premier groupe de fonctions de surveillance (5) sont mises en œuvre dans les circuits qui surveillent les fonctions de base. La puce semi-conductrice a par ailleurs une troisième zone (6), laquelle est formée sur la puce semi-conductrice (1) et est séparée des autres zones (2, 3) au moyen de mesures de sécurité technologiques et dans laquelle un deuxième groupe de fonctions de surveillance (7) sont mises en œuvre dans les circuits, lesdites fonctions de surveillance surveillant les fonctions de base.
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