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1. WO2020138642 - RESIN COMPOSITION, METAL LAMINATE AND PRINTED CIRCUIT BOARD WHICH USE SAME, AND METHOD FOR MANUFACTURING METAL LAMINATE

Publication Number WO/2020/138642
Publication Date 02.07.2020
International Application No. PCT/KR2019/011257
International Filing Date 02.09.2019
IPC
C08L 27/12 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
27Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
02not modified by chemical after-treatment
12containing fluorine atoms
C08L 25/08 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
02Homopolymers or copolymers of hydrocarbons
04Homopolymers or copolymers of styrene
08Copolymers of styrene
C08L 27/18 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
27Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
02not modified by chemical after-treatment
12containing fluorine atoms
18Homopolymers or copolymers of tetrafluoroethene
C08L 101/02 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
02characterised by the presence of specified groups
C08L 101/04 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
02characterised by the presence of specified groups
04containing halogen atoms
C08K 3/36 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
CPC
B32B 15/043
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
043of metal
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
B32B 27/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
06as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
C08K 3/22
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
C08K 3/36
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
34Silicon-containing compounds
36Silica
C08L 101/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
02characterised by the presence of specified groups ; , e.g. terminal or pendant functional groups
Applicants
  • 주식회사 두산 DOOSAN CORPORATION [KR]/[KR]
Inventors
  • 이진수 LEE, Jinsoo
  • 김형규 KIM, Hyungkyu
  • 조경운 CHO, Kyeongwoon
Agents
  • 특허법인 위더피플 WE THE PEOPLE IP & LAW FIRM
Priority Data
10-2018-017067827.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) RESIN COMPOSITION, METAL LAMINATE AND PRINTED CIRCUIT BOARD WHICH USE SAME, AND METHOD FOR MANUFACTURING METAL LAMINATE
(FR) COMPOSITION DE RÉSINE, STRATIFIÉ MÉTALLIQUE ET CARTE DE CIRCUIT IMPRIMÉ L'UTILISANT, ET PROCÉDÉ DE FABRICATION DE STRATIFIÉ MÉTALLIQUE
(KO) 수지 조성물, 이를 이용한 금속 적층체와 인쇄회로기판 및 상기 금속 적층체의 제조방법
Abstract
(EN)
The present invention relates to a resin composition, a metal laminate and a printed circuit board which use same, and a method for manufacturing the metal laminate, wherein the resin composition comprises: at least one elastomer selected from the group consisting of a fluoroelastomer and a styrene-based elastomer; a fluororesin filler; and an inorganic filler.
(FR)
La présente invention concerne une composition de résine, un stratifié métallique et une carte de circuit imprimé qui l'utilisent, et un procédé de fabrication du stratifié métallique, la composition de résine comprenant : au moins un élastomère choisi dans le groupe constitué par un fluoroélastomère et un élastomère à base de styrène; une charge de résine fluorée; et une charge inorganique.
(KO)
본 발명은 수지 조성물, 이를 이용한 금속 적층체와 인쇄회로기판 및 상기 금속 적층체의 제조방법에 대한 것으로, 상기 수지 조성물은 불소계 엘라스토머 및 스티렌계 엘라스토머로 이루어진 군에서 선택된 1종 이상의 엘라스토머; 불소 수지 필러; 및 무기 필러를 포함한다.
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