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1. WO2021080341 - ELECTRONIC DEVICE COMPRISING MICROPHONE MODULE

Publication Number WO/2021/080341
Publication Date 29.04.2021
International Application No. PCT/KR2020/014474
International Filing Date 22.10.2020
IPC
H04R 1/08 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers
08Mouthpieces; Attachments therefor
H04R 1/28 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers
20Arrangements for obtaining desired frequency or directional characteristics
22for obtaining desired frequency characteristic only
28Transducer mountings or enclosures designed for specific frequency response; Transducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
G06F 1/16 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
Applicants
  • 삼성전자 주식회사 SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • 한브라이언 HAN, Brian
  • 성민철 SUNG, Minchul
Agents
  • 권혁록 KWON, Hyuk-Rok
  • 이정순 LEE, Jeong-Soon
Priority Data
10-2019-013355125.10.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) ELECTRONIC DEVICE COMPRISING MICROPHONE MODULE
(FR) DISPOSITIF ÉLECTRONIQUE COMPRENANT UN MODULE DE MICROPHONE
(KO) 마이크 모듈을 포함하는 전자 장치
Abstract
(EN)
An electronic device according to various embodiments of the present invention comprises: a housing comprising a first plate disposed to face a first direction, a second plate disposed to face a second direction opposite to the first direction, and a lateral surface member, which is disposed to face a third direction perpendicular to the first and second directions, encompasses at least a part of the space between the first and second plates, and has at least one microphone hole; a printed circuit board disposed between the first and second plates; a microphone module coupled to one surface of the printed circuit board facing the first direction, and disposed to be adjacent to the lateral surface member; and a microphone sound path for connecting sound from the microphone hole to the microphone module, wherein the microphone sound path can include an opening formed in the one surface of the printed circuit board facing the microphone module and extended toward the microphone hole. Other various embodiments are possible.
(FR)
Divers modes de réalisation de la présente invention concernent un dispositif électronique comprenant : un boîtier comprenant une première plaque disposée de façon à faire face à une première direction, une deuxième plaque disposée de façon à faire face à une deuxième direction opposée à la première direction, et un élément de surface latérale, qui est disposé de façon à faire face à une troisième direction perpendiculaire aux première et deuxième directions, englobe au moins une partie de l'espace entre les première et deuxième plaques et comporte au moins un trou de microphone ; une carte de circuit imprimé disposée entre les première et deuxième plaques ; un module de microphone couplé à une surface de la carte de circuit imprimé faisant face à la première direction, et disposé de façon à être adjacent à l'élément de surface latérale ; et un trajet de son de microphone destiné à connecter le son du trou de microphone au module de microphone, le trajet de son de microphone pouvant comprendre une ouverture formée dans la surface de la carte de circuit imprimé faisant face au module de microphone et s'étendant vers le trou de microphone. Divers autres modes de réalisation sont possibles.
(KO)
본 발명의 다양한 실시예에 따른 전자 장치는 제1방향으로 향하게 배치되는 제1플레이트와, 상기 제1방향과 반대방향으로 향하는 제2방향으로 향하게 배치되는 제2플레이트와, 상기 제1,2방향과 수직인 제3방향으로 향하게 배치되며, 상기 제1,2플레이트 사이의 공간의 적어도 일부를 감싸고, 적어도 하나 이상의 마이크 홀이 형성된 측면 부재를 포함하는 하우징; 상기 제1,2플레이트 사이에 배치된 인쇄회로기판; 상기 제1방향으로 향하는 상기 인쇄회로기판 일면에 접합되고, 상기 측면 부재와 근접하게 배치되는 마이크 모듈; 및 상기 마이크 홀에서 상기 마이크 모듈까지 음향을 연결하는 마이크 음향 경로를 포함하고, 상기 마이크 음향 경로는 상기 마이크 모듈과 대면하는 상기 인쇄회로기판 일면에 형성되며, 상기 마이크 홀쪽으로 연장된 개구를 포함할 수 있다. 그 밖에 다양한 실시예들이 가능하다.
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