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1. WO2020140769 - DISPLAY BACKPLANE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE

Publication Number WO/2020/140769
Publication Date 09.07.2020
International Application No. PCT/CN2019/126939
International Filing Date 20.12.2019
IPC
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 27/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
CPC
H01L 21/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
H01L 27/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/1218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1218with a particular composition or structure of the substrate
H01L 27/1296
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
12the substrate being other than a semiconductor body, e.g. an insulating body
1214comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
1259Multistep manufacturing methods
1296adapted to increase the uniformity of device parameters
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 51/0012
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0012special provisions for the orientation or alignment of the layer to be deposited
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 鄂尔多斯市源盛光电有限责任公司 ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. [CN]/[CN]
Inventors
  • 薛智勇 XUE, Zhiyong
  • 白妮妮 BAI, Nini
  • 彭利满 PENG, Liman
  • 刘亮亮 LIU, Liangliang
  • 张倩倩 ZHANG, Qianqian
  • 刘淑杰 LIU, Shujie
  • 李海龙 LI, Hailong
  • 马玲玲 MA, Lingling
  • 米红玉 MI, Hongyu
  • 刘旭 LIU, Xu
  • 陈强 CHEN, Qiang
  • 景国栋 JING, Guodong
Agents
  • 北京银龙知识产权代理有限公司 DRAGON INTELLECTUAL PROPERTY LAW FIRM
Priority Data
201910007859.804.01.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY BACKPLANE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE
(FR) FOND DE PANIER D'AFFICHAGE ET SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF D'AFFICHAGE
(ZH) 显示背板及其制作方法、显示装置
Abstract
(EN)
A display backplane and a method for manufacturing same, and a display device. The display backplane comprises: a substrate (1), an electronic device and an alignment mark (3) provided on the substrate (1), and a filling layer (2). The filling layer (2) fills at least part of a recessed area (4) on the surface of the substrate (1) facing away from the electronic device; the minimum distance between the orthogonal projection of the at least part of the recessed area (4) on the substrate (1) and the orthogonal projection of the alignment mark (3) on the substrate (1) is less than 200 μm.
(FR)
La présente invention concerne un fond de panier d'affichage et son procédé de fabrication, et un dispositif d'affichage. Le fond de panier d'affichage comprend : un substrat (1), un dispositif électronique et une marque d'alignement (3) disposés sur le substrat (1), et une couche de remplissage (2). La couche de remplissage (2) remplit au moins une partie d'une zone évidée (4) sur la surface du substrat (1) tournée à l'opposé du dispositif électronique ; la distance minimale entre la projection orthogonale de l'au moins une partie de la zone évidée (4) sur le substrat (1) et la projection orthogonale de la marque d'alignement (3) sur le substrat (1) est inférieure à 200 µm.
(ZH)
一种显示背板及其制作方法、显示装置。所述显示背板包括:基底(1),设置在所述基底(1)上的电子器件和对位标识(3),以及填充层(2),所述填充层(2)填充位于所述基底(1)背向所述电子器件的表面的至少部分凹陷区域(4),所述至少部分凹陷区域(4)在所述基底(1)上的正投影与所述对位标识(3)在所述基底(1)上的正投影之间的最小距离小于200μm。
Also published as
Latest bibliographic data on file with the International Bureau