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1. WO2020138221 - WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Publication Number WO/2020/138221
Publication Date 02.07.2020
International Application No. PCT/JP2019/050973
International Filing Date 25.12.2019
IPC
H01L 23/12 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/11 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
CPC
H01L 23/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/11
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP]
Inventors
  • 伊藤 征一朗 ITOU, Seiichirou
Agents
  • 荒船 博司 ARAFUNE, Hiroshi
  • 荒船 良男 ARAFUNE, Yoshio
Priority Data
2018-24328326.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
(FR) SUBSTRAT DE CÂBLAGE, DISPOSITIF ÉLECTRONIQUE ET MODULE ÉLECTRONIQUE
(JA) 配線基板、電子装置及び電子モジュール
Abstract
(EN)
A wiring substrate comprising: a substrate having a first surface, a second surface on the opposite side from the first surface, and a side surface connected to each of the first surface and the second surface; a first metal film disposed so as to extend from the first surface over the side surface; and a second metal film disposed so as to extend from the second surface and over the first metal film that is disposed on the side surface.
(FR)
Un substrat de câblage comprend : un substrat ayant une première surface, une seconde surface sur le côté opposé à la première surface, et une surface latérale reliée à chacune de la première surface et de la seconde surface ; un premier film métallique disposé de façon à s'étendre à partir de la première surface sur la surface latérale ; et un second film métallique disposé de façon à s'étendre à partir de la seconde surface et sur le premier film métallique qui est disposé sur la surface latérale.
(JA)
配線基板は、第1面、第1面とは反対側の第2面、並びに、第1面及び第2面のそれぞれにつながる側面を有する基板と、第1面から側面にまたがって位置する第1金属膜と、第2面から側面に位置する第1金属膜の上にまたがって位置する第2金属膜とを備える。
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