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1. WO2020138221 - WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WO/2020/138221WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Appl.Date 25.12.2019
Appl.No PCT/JP2019/050973 Applicant KYOCERA CORPORATION Pub.Kind A Pub.Lang ja
Inclusion Criteria IC1
PCT application from which the family originated.
Pub.Date 02.07.2020
CN113228259布线基板、电子装置以及电子模块
Appl.Date 25.12.2019
Appl.No 201980085720.3 Applicant 京瓷株式会社 Pub.Kind A
Inclusion Criteria IC2
National entry of a PCT application.

If this application is not visible in the National Phase tab of the PCT application, its relationship to the PCT application is identified from the PCT or regional filing or publication information of its bibliographic data.

Pub.Date 06.08.2021
JPWO2020138221配線基板、電子装置及び電子モジュール
Appl.Date 25.12.2019
Appl.No 2020563377 Applicant 京セラ株式会社 Pub.Kind A Pub.Lang ja
Inclusion Criteria IC2
National entry of a PCT application.

If this application is not visible in the National Phase tab of the PCT application, its relationship to the PCT application is identified from the PCT or regional filing or publication information of its bibliographic data.

Pub.Date 02.07.2020
EP2019902006
Appl.Date 26.07.2021
Appl.No 2019902006
Inclusion Criteria IC3
National entry of a PCT application not found in PATENTSCOPE.