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1. WO2018125162 - SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER

WO/2018/125162SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER
Appl.Date 29.12.2016
Appl.No PCT/US2016/069308 Applicant INTEL CORPORATION Related Type IC1
PCT application from which the family originated.
Pub.Kind A Pub.Lang en
Pub.Date 05.07.2018
US20190287942SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER
Appl.Date 29.12.2016
Appl.No 16349543 Applicant Intel Corporation Related Type IC2
National entry of a PCT application.

If this application is not visible in the National Phase tab of the PCT application, its relationship to the PCT application is identified from the PCT or regional filing or publication information of its bibliographic data.

Pub.Kind A1
Pub.Date 19.09.2019