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1. EP0880818 - LOW VOLTAGE ELECTROSTATIC CLAMP FOR SUBSTRATES SUCH AS DIELECTRIC SUBSTRATES

Office
European Patent Office
Application Number 96945445
Application Date 20.12.1996
Publication Number 0880818
Publication Date 02.12.1998
Publication Kind B1
IPC
B25J 15/06
BPERFORMING OPERATIONS; TRANSPORTING
25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
15Gripping heads
06with vacuum or magnetic holding means
B05C 13/02
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
CAPPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
13Means for manipulating or holding work, e.g. for separate articles
02for particular articles
G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
H02N 13/00
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
13Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
CPC
G03F 7/70708
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70691Handling of masks or wafers
707Chucks, e.g. chucking or un-chucking operations
70708being electrostatic; Electrostatically deformable vacuum chucks
G03F 7/707
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70691Handling of masks or wafers
707Chucks, e.g. chucking or un-chucking operations
H01L 21/6831
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6831using electrostatic chucks
H02N 13/00
HELECTRICITY
02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
13Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Y10T 279/23
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
279Chucks or sockets
23with magnetic or electrostatic means
Applicants LAM RES CORP
Inventors SHUFFLEBOTHAM PAUL KEVIN
BARNES MICHAEL SCOTT
Designated States
Priority Data 08577382 22.12.1995 US
9620883 20.12.1996 US
Title
(DE) ELEKTROSTATISCHE NIEDERSPANNUNGSKLEMMVORRICHTUNG FÜR SUBSTRATE WIE DIELEKTRISCHE SUBSTRATE
(EN) LOW VOLTAGE ELECTROSTATIC CLAMP FOR SUBSTRATES SUCH AS DIELECTRIC SUBSTRATES
(FR) DISPOSITIF DE SERRAGE ELECTROSTATIQUE BASSE TENSION DESTINE A DES SUBSTRATS TELS QUE DES SUBSTRATS DIELECTRIQUES
Abstract
(EN)
An electrostatic clamp (10) for dielectric substrates (12) is operated with a low voltage electric source by reducing the width of electrode lines (14) to less than 100 $g(m)m and by reducing the spacing between adjacent electrode lines to less than 100 $g(m)m. The electrostatic clamp (10) includes an array of electrodes (14) such as aluminum formed on a base of insulating material (12) such as glass and covered by an insulating layer (24) such as nitride which covers and protects the electrodes. Electrical contacts (16, 18) apply voltages of opposite polarities to alternating electrode lines (14) to create a non-uniform electric field which causes a dielectric substrate (22) to be pulled toward the region of highest electric field. The reduced width electrode lines and spacings are created by the use of micro-lithographic techniques including thin film deposition and etching for formation of the electrode and the coating layers.

(FR)
Un dispositif de serrage électrostatique (10) destiné à des substrats diélectriques (12) est mis en oeuvre par une source électrique basse tension, la largeur des lignes d'électrodes (14) étant réduite à moins de 100 $g(m)m et l'espacement entre les lignes d'électrode adjacentes étant réduit à moins de 100 $g(m)m. Le dispositif (10) de serrage électrostatique comprend un réseau d'électrodes (14) telles que des électrodes en aluminium formées sur une base de matériau isolant (12) tel que du verre et recouvert par une couche isolante (24) telle que du nitrure qui recouvre et protège les électrodes. Des contacts électriques (16, 18) appliquent des tensions de polarités opposées sur les lignes d'électrodes (14) alternatives pour créer un champ électrique non uniforme qui provoque l'attraction du substrat diélectrique vers la région de champ électrique maximum. On crée les lignes d'électrodes et les espacements à largeur réduite à l'aide de techniques micro-lithographiques comprenant le dépôt de film mince et la gravure pour former l'électrode et les couches de revêtement.

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