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1. WO2020139832 - GROOVED, STACKED-PLATE SUPERCONDUCTING MAGNETS AND ELECTRICALLY CONDUCTIVE TERMINAL BLOCKS AND RELATED CONSTRUCTION TECHNIQUES

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[ EN ]

CLAIMS

What is claimed is:

1 . An apparatus, comprising:

an electrically conductive plate having a groove; and

a high-temperature superconductor (HTS) tape stack disposed in the groove, the HTS tape stack having a spiral shape.

2. The apparatus of claim 1 , wherein the groove has a spiral shape.

3. The apparatus of any preceding claim, wherein the electrically conductive plate comprises a metal or a metal alloy.

4. The apparatus of any preceding claim, further comprising a coolant channel.

5. The apparatus of claim 4, wherein the coolant channel is disposed in the groove.

6. The apparatus of claim 4, wherein the coolant channel is disposed outside the groove.

7. The apparatus of any preceding claim, wherein the HTS tape stack is a non-insulated HTS tape stack.

8. The apparatus of any preceding claim, wherein the HTS tape stack comprises a plurality of turns, wherein the electrically conductive plate provides electrical connections between respective turns of the plurality of turns.

9. The apparatus of any preceding claim, further comprising a shim or a bladder in the groove.

10. The apparatus of any preceding claim, wherein the electrically conductive plate is a first electrically conductive plate, the groove is a first groove, and the HTS tape stack is a first HTS tape stack, and the apparatus further comprises: a second electrically conductive plate having a second groove; and a second HTS tape stack disposed in the second groove, the second HTS tape stack having a spiral shape,

wherein the first HTS tape stack is electrically coupled to the second HTS tape stack.

1 1. The apparatus of claim 10, wherein the first electrically conductive plate is electrically insulated from the second electrically conductive plate.

12. The apparatus of claim 10 or 1 1 , wherein the first and/or second electrically conductive plates have one or more alignment structures to align the first and second electrically conductive plates when the first and second electrically conductive plates are mated together.

13. The apparatus of any of claims 10-12, further comprising a conductive connection between the first HTS tape stack and the second HTS tape stack.

14. The apparatus of claim 13, wherein the conductive connection comprises a high temperature superconductor or a metal that is not a superconductor at a temperature above 30 degrees Kelvin.

15. The apparatus of claim 13 or 14, wherein the conductive connection comprises copper.

16. The apparatus of any of claims 13-15, wherein the conductive connection is formed between innermost turns of the first and second HTS tape stacks or between outermost turns of the first and second HTS tape stacks.

17. The apparatus of claim 13, 14 or 16, wherein the first HTS tape stack and the second HTS tape stack are a same HTS tape stack.

18. The apparatus of claim 17, wherein a transition between the first HTS tape stack and the second HTS tape stack is formed by a helical portion of the same HTS tape stack.

19. The apparatus of any preceding claim, wherein the first groove comprises at least first and second turns, wherein the first turn has a first width and the second turn has a second width, wherein the second width is greater than the first width.

20. The apparatus of claim 19, wherein the second turn of the groove comprises a plurality of turns of the HTS tape stack.

21. The apparatus of any preceding claim, wherein the apparatus comprises a magnet.

22. The apparatus of any preceding claim, wherein the HTS tape stack comprises a rare-earth oxide.

23. The apparatus of any preceding claim, wherein the HTS tape stack comprises rare-earth barium copper oxide.

24. The apparatus of any preceding claim, further comprising a conductive terminal block electrically coupled to the HTS tape stack.

25. A fabrication method, comprising:

forming an electrically conductive plate having a groove; and

disposing a high-temperature superconductor (HTS) tape stack into the groove in a spiral shape.

26. A stacked-plate magnet assembly comprising:

a first electrically conductive plate having provided therein at least one groove having a spiral shape;

a second electrically conductive plate disposed over said first plate, said second plate having provided at least a groove having a spiral shape such that when a first surface of the first plate is disposed over a first surface of the second plate, said grooves form a spiral channel having an opening at a first end thereof on the first plate, a helical shaped path to the second plate, and an out-going path on the second electrically conductive plate;

an electrically insulating material disposed between the first and second plates;

a non-insulated (Nl) high temperature superconductor (HTS) tape stack having a length such that said Nl HTS tape stack may be disposed in the channel formed by the grooves of said first and second electrically conductive plates such that said Nl HTS tape stack forms a continuous path from a first outer-most surface of the first electrically conductive plate to a second outer-most surface of the second electrically conductive plate wherein said HTS tape is configured in said channel such that in response to generated forces, said HTS tape stack distributes forces into said first and second electrically conductive plates.

27. The stacked-plate magnet assembly of claim 26 wherein said Nl HTS tape stack further comprises a co-wind material disposed in the channel such that said Nl HTS tape and co-wind stack follows a path from a first outer-most surface of the first electrically conductive plate to a second outer-most surface of the second electrically conductive plate wherein said HTS tape and co-wind stack configured in said channel such that in response to generated forces said HTS tape and co wind stack distributes forces into said first and second electrically conductive plates wherein said co-wind material may be provided as one or more of: an electrically conducting material; an electrically insulating material and/or an electrically semiconducting material.

28. The stacked-plate magnet assembly of claim 26 wherein more than one HTS tape stack is disposed into the groove with material disposed between the stacks.

29. The stacked-plate magnet assembly of claim 28 wherein material disposed between stacks is mechanically connected with the plate.

30. The stacked-plate magnet assembly of claim 29 wherein material disposed between stacks is disposed in spiral grooves in the plate, separately or in conjunction with the tape stacks.

31. The stacked-plate magnet assembly of claim 27 wherein the materials comprising the Nl HTS tape stack in the first and second plates are continuous across the plates.

32. The stacked-plate magnet assembly of claim 31 wherein the Nl HTS tape stack is comprised of two or more Nl HTS tape stacks joined by a low resistance electrical connection.

33. The stacked-plate magnet assembly of claim 26 wherein said Nl HTS tape stack comprises one or more HTS tapes and wherein the number, size and type of HTS tapes in said Nl HTS tape stack varies along a length of said Nl HTS tape stack.

34. The stacked-plate magnet assembly of claim 26 wherein the grooves in the first and second electrically conductive plates are substantially identical.

35. The stacked-plate magnet assembly of claim 32 wherein said first and second electrically conductive plate have substantially identical spiral-shaped grooves and wherein said first and second plates are assembled back-to-back or front-to-front.

36. The stacked-plate magnet assembly of claim 33 wherein said channel defines an in-going spiral on said first electrically conductive plate, the in-going spiral having a first end and a second ends, a helical opening having a first end and a second end with the first end of said helical opening coupled to the second end of the in-going spiral and a second end which leads to the to the second

electrically conductive plate and coupled to a first end of an out-going spiral provided in said second electrically conductive plate.

37. The stacked-plate magnet assembly of claim 36 further comprising a bladder disposed in the channel with said HTS tape stack.

38. The stacked-plate magnet assembly of claim 27 wherein said co-wind materials and surface coatings are selected to optimize magnet quench behavior.

39. The stacked-plate magnet assembly of claim 27 wherein the HTS tape and co-wind stack is embedded in a matrix of high electrical conductivity material at points: where the HTS tape and co-wind stack passes between stacked plates; where the HTS tape and co-wind stack enters into and exit from the magnet assembly; and where electrical interconnections are formed between spiral windings.

40. The stacked-plate magnet assembly of claim 26 further comprising a bladder included in the HTS tape stack.

41. The stacked-plate magnet assembly of claim 40 wherein said bladder is configured in the HTS tape stack to preload the HTS tape stack prior to soldering or to eliminate the need for soldering.

42. The stacked-plate magnet assembly of claim 40 wherein said bladder element is configured in the HTS tape stack to eliminate the need for soldering.

43. The stacked-plate magnet assembly of claim 40 wherein said bladder element is configured to pre-compress the HTS tape stack against a load-bearing sidewall of the at least one spiral groove.

44. The stacked-plate magnet assembly of claim 40 wherein said bladder element contains a material that is liquid or gaseous during magnet assembly and solid or liquid or gaseous or evacuated during magnet operation.

45. The stacked-plate magnet assembly of claim 38 wherein said bladder element contains a material that exhibits a phase change from solid to liquid and/or liquid to gas during magnet operation.

46. The stacked-plate magnet assembly of claim 26 further comprising at least one coolant channel.

47. The stacked-plate magnet assembly of claim 46 wherein the coolant channel comprises one or more coolant pathways disposed along said HTS tape stack.

48. The stacked-plate magnet assembly of claim 46 wherein the at least one coolant channel comprises one or more cooling channel plates interleaved with one or both of the first plate and second plate.

49. The stacked-plate magnet assembly of claim 46 wherein the at least one coolant channel comprises one or more coolant pathways disposed along a path that is different from that of the HTS tape stack.

50. The stacked-plate magnet assembly of claim 26 further comprising a conducting plate inserted between the first and second plates.

51. The stacked-plate magnet assembly of claim 26 further comprising high electrical conductivity coatings on the plates at selected locations.

52. The stacked-plate magnet assembly of claim 26 wherein the conducting plate comprises copper in whole or in part.

53. The stacked-plate magnet assembly of claim 50 wherein the conducting plate comprises copper in whole or in part.

54. The stacked-plate magnet assembly of claim 50 wherein the conducting plate is configured to provide conduction cooling.

55. The stacked-plate magnet assembly of claim 26 further comprising one or more low resistance electrical interconnections between the Nl HTS stacks in the first and second plates configured to maintain a high-resistance electrical connection between the stacked plates.

56. A method for constructing a high-field, stacked-plate magnet assembly, the method comprising:

assembling a series of identical non-insulated (Nl), high temperature superconductor (HTS) loaded spiral-grooved plates, stacked between coolant channel plates, conduction cooled plates or insulating plates with said Nl HTS tape stacks forming a continuous path from a first end to a second end, or through the use of interconnections, forming a low electrical resistance path from a first end to a second; and

forming one or more inter-pancake electrical connections, each of the one or more inter-pancake connections having a low resistance characteristic.

57. The method of claim 56 wherein forming one or more inter-pancake connections comprises forming one or more inter-pancake connections automatically.

58. The method of claim 57 further comprising pre-loading HTS tape stacks in the spiral-grooved plates.

59. A stacked-plate magnet assembly comprising:

a first electrically conductive plate having a first surface with a plurality of spiral-shaped grooves provided therein, the spiral-shaped grooves defined by one or more spiral-shaped walls with at least two grooves of the plurality of grooves having a different width;

a second electrically conductive plate disposed over the first plate, such that when a first surface of the first plate is disposed over the first surface of the second plate, the grooves form a spiral channel having an opening at a first end thereof; and

a non-insulated (Nl) high temperature superconductor (HTS) tape stack having a length such that said Nl HTS tape stack may be disposed in the plurality of spiral-shaped grooves of the first electrically conductive plate and such that the Nl HTS tape stack forms a continuous path between an outer-most groove in the first electrically conductive plate and an innermost groove of the first electrically conductive plate and wherein the HTS tape is configured in each groove such that in response to generated forces, the HTS tape stack distributes forces into the first and second electrically conductive plates.

60. The stacked-plate magnet assembly of claim 59 wherein the HTS tape stack is disposed within one of the plurality of grooves of varying widths and is wound against itself to occupy the width of the groove.

61. The stacked-plate magnet assembly of claim 59 wherein the walls which define the grooves in the first electrically conductive plate are provided having a variable wall thickness such that a thickness of a first portion of a wall is different from a thickness of a second portion of the same wall.

62. The stacked-plate magnet assembly of claim 59 wherein the walls which define the grooves in the first electrically conductive plate are provided having different wall thickness.

63. The stacked-plate magnet assembly of claim 62 wherein a thickness of a first portion of a first wall in a first radial direction as measured from a center of the first electrically conductive plate differs from a thickness of a first portion of a second, different wall along the same first radial direction.

64. The stacked-plate magnet assembly of claim 59 wherein said first and second electrically conductive plate have substantially identical spiral-shaped grooves.

65. The stacked-plate magnet assembly of claim 64 wherein the Nl HTS tape stack is comprised of two or more Nl HTS tape stacks joined by a low resistance electrical connection.

66. The stacked-plate magnet assembly of claim 64 wherein the materials comprising the Nl HTS tape stack in the first and second plates are continuous across the plates.

67. The stacked-plate magnet assembly of claim 59 wherein said Nl HTS tape stack further comprises a co-wind material disposed in the groove such that the Nl HTS tape and co-wind stack follows a path between a first outer-most groove of the first electrically conductive plate and an innermost groove of the first electrically conductive plate wherein the HTS tape and co-wind stack are configured in the grooves such that in response to generated forces, the HTS tape and co-wind stack distribute forces into the first and second electrically conductive plates.

68. The stacked-plate magnet assembly of claim 67 wherein the co-wind material is provided as one or more of: an electrically conducting material; an electrically insulating material and/or an electrically semiconducting material.

69. The stacked-plate magnet assembly of claim 67 wherein the co-wind materials are selected to optimize magnet quench behavior, or magnet charging behavior, or both.

70. The stacked-plate magnet assembly of claim 67 wherein the HTS tape and co-wind stack is embedded in a matrix of high electrical conductivity material at points where:

the HTS tape and co-wind stack passes between stacked plates;

the HTS tape and co-wind stack enters into and exit from the magnet assembly; and

electrical interconnections are formed between spiral windings.

71. The stacked-plate magnet assembly of claim 67 wherein the co-wind material varies in either composition or thickness along a length of the Nl HTS tape stack.

72. The stacked-plate magnet assembly of claim 59 wherein an electrically insulating material is placed at selected areas between the stacked plates.

73. The stacked-plate magnet assembly of claim 59 wherein the Nl HTS tape stack comprises one or more HTS tapes and wherein the number, size and type of HTS tapes in said Nl HTS tape stack varies along a length of said Nl HTS tape stack.

74. The stacked-plate magnet assembly of claim 73 wherein the groove defines an in-going spiral on the first electrically conductive plate, the in-going spiral having a first end and a second end, and the first electrical plate has a helical opening provided therein, the helical opening having a first end and a second end with the first end of the helical opening coupled to the second end of the in-going spiral and a second end of the helical opening which leads to the to the second electrically conductive plate and coupled to a first end of an out-going spiral provided in said second electrically conductive plate.

75. The stacked-plate magnet assembly of claim 59 further comprising a bladder included in the HTS tape stack.

76. The stacked-plate magnet assembly of claim 75 wherein said bladder element is configured to pre-compress the HTS tape stack against a load-bearing sidewall of the at least one spiral groove.

77. The stacked-plate magnet assembly of claim 75 wherein said bladder element contains a material that is liquid or gaseous during magnet assembly and solid or liquid or gaseous or evacuated during magnet operation.

78. The stacked-plate magnet assembly of claim 75 wherein said bladder element contains a material that exhibits a phase change from solid to liquid and/or liquid to gas during magnet operation.

79. The stacked-plate magnet assembly of claim 59 wherein the first conductive plate has at least one coolant channel provided therein.

80. The stacked-plate magnet assembly of claim 79 wherein the coolant channel comprises one or more coolant pathways disposed along said HTS tape stack.

81. The stacked-plate magnet assembly of claim 80 wherein the at least one coolant channel comprises one or more cooling channel plates interleaved with one or both of the first plate and second electrically conductive plates.

82. The stacked-plate magnet assembly of claim 80 wherein the at least one coolant channel comprises one or more coolant pathways disposed along a path that is different from that of the HTS tape stack.

83. The stacked-plate magnet assembly of claim 59 further comprising a conducting plate inserted between the first and second electrically conductive plates.

84. The stacked-plate magnet assembly of claim 59 further comprising high electrical conductivity coatings disposed on selected locations of at least one of the first and second electrically conductive plates.

85. The stacked-plate magnet assembly of claim 84 wherein the conducting plate comprises copper in whole or in part.