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1. WO2020133260 - FPC CAPABLE OF IMPROVING AGGREGATION OF CONDUCTIVE PARTICLES, CONDUCTIVE BONDING STRUCTURE, AND TOUCH SENSOR

Publication Number WO/2020/133260
Publication Date 02.07.2020
International Application No. PCT/CN2018/125018
International Filing Date 28.12.2018
IPC
H05K 1/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
H01L 23/488 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
CPC
H01L 23/488
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
H05K 1/14
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
Applicants
  • 深圳市柔宇科技有限公司 SHENZHEN ROYOLE TECHNOLOGIES CO., LTD. [CN]/[CN]
Inventors
  • 陈林海 CHEN, Linhai
Agents
  • 北京超凡志成知识产权代理事务所(普通合伙) CHOFN INTELLECTUAL PROPERTY
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FPC CAPABLE OF IMPROVING AGGREGATION OF CONDUCTIVE PARTICLES, CONDUCTIVE BONDING STRUCTURE, AND TOUCH SENSOR
(FR) FPC CAPABLE D'AMÉLIORER L'AGRÉGATION DE PARTICULES CONDUCTRICES, STRUCTURE DE LIAISON CONDUCTRICE ET CAPTEUR TACTILE
(ZH) 一种改善导电粒子聚集的FPC、导电结合结构和触控传感器
Abstract
(EN)
The present application provides an FPC capable of improving aggregation of conductive particles, a conductive bonding structure, and a touch sensor. The conductive bonding structure and the touch sensor comprise the FPC capable of improving aggregation of conductive particles. The FPC comprises a first base layer (111), a second base layer (113), and a first conductive layer (114) sandwiched between the first base layer (111) and the second base layer (113); the first conductive layer (114) comprises multiple first pins (115) disposed at intervals; the first base layer (111) exposes ends of the first pins (115); an edge of the first base layer (111) is provided with grooves (112); each groove (112) is located between two adjacent first pins (115); the groove (112) is used for lengthening a path for accumulation of conductive particles (05). Providing the groove (112) at the edge of the first base layer (111) can lengthen the path for accumulation of the conductive particles (05), thereby reducing the risk of short circuit of the two adjacent first pins (115).
(FR)
La présente invention concerne un FPC capable d'améliorer l'agrégation de particules conductrices, une structure de liaison conductrice et un capteur tactile. La structure de liaison conductrice et le capteur tactile comprennent le FPC capable d'améliorer l'agrégation de particules conductrices. Le FPC comprend une première couche de base (111), une seconde couche de base (113), et une première couche conductrice (114) prise en sandwich entre la première couche de base (111) et la seconde couche de base (113) ; la première couche conductrice (114) comprend de multiples premières broches (115) disposées à intervalles ; la première couche de base (111) expose les extrémités des premières broches (115) ; un bord de la première couche de base (111) est pourvu de rainures (112) ; chaque rainure (112) est située entre deux premières broches adjacentes (115) ; la rainure (112) est utilisée pour allonger un trajet pour l'accumulation de particules conductrices (05). La disposition de la rainure (112) au niveau du bord de la première couche de base (111) peut allonger le trajet pour l'accumulation des particules conductrices (05), réduisant ainsi le risque de court-circuit des deux premières broches adjacentes (115).
(ZH)
本申请提供了一种改善导电粒子聚集的FPC、导电结合结构和触控传感器。导电结合结构和触控传感器包括上述改善导电粒子聚集的FPC。FPC包括第一基层(111)、第二基层(113)以及夹持于第一基层(111)与第二基层(113)之间的第一导电层(114);第一导电层(114)包括间隔设置的多根第一引脚(115),第一基层(111)裸露出第一引脚(115)的端部,第一基层(111)的边缘开设有凹槽(112),凹槽(112)位于相邻两根第一引脚(115)之间,凹槽(112)用于增长导电粒子(05)堆积的路径。在第一基层(111)的边缘开设凹槽(112)能够增长导电粒子(05)堆积的路径,降低相邻两个第一引脚(115)短路的风险。
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