(12) International Application Status Report

Received at International Bureau: 09 January 2020 (09.01.2020)

Information valid as of: 30 September 2020 (30.09.2020)

Report generated on: 07 March 2021 (07.03.2021)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2020/22239405 November 2020 (05.11.2020) Korean (KO)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/KR2019/01850126 December 2019 (26.12.2019) Korean (KO)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
10-2019-0050165 (KR)30 April 2019 (30.04.2019) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
B21D 22/02 (2006.01); B21D 37/16 (2006.01); C22C 38/38 (2006.01); C22C 38/32 (2006.01)

(71) Applicant(s):
HYUNDAI STEEL COMPANY [KR/KR]; 63, Jungbong-daero Dong-gu Incheon 22525 (KR) (for all designated states)

(72) Inventor(s):
KONG, Je Youl; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
KIM, Ji Young; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
PARK, Young Chul; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
KIM, Hye Jin; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
YOO, Byung Gil; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
YOOK, Wan; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
YOON, Seung Chae; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
YIM, Gi Hak; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)
JANG, Jeong Hwan; 63, Jungbong-daero Dong-gu Incheon 22525 (KR)

(74) Agent(s):
AJU INTERNATIONAL LAW & PATENT GROUP; 13th-14th Floors, Donghee Building, 302, Gangnam-daero Gangnam-gu Seoul 06253 (KR)

(54) Title (EN): HOT-STAMPED PART AND MANUFACTURING METHOD THEREFOR
(54) Title (FR): PIÈCE ESTAMPÉE À CHAUD ET SON PROCÉDÉ DE FABRICATION
(54) Title (KO): 핫 스탬핑 부품 및 그 제조방법

(57) Abstract:
(EN): A hot-stamped part according to an embodiment of the present invention comprises, as a base layer, a steel comprising: 0.28-0.38 wt% of carbon (C); 0.1-0.4 wt% of silicon (Si); 1.2-2.0 wt% of manganese (Mn); from greater than 0 to 0.020 wt% of phosphorus (P); from greater than 0 to 0.003 wt% of sulfur (S); 0.1-0.5 wt% of chromium (Cr); 0.0015-0.0040 wt% of boron (B); 0.025-0.05 wt% of titanium (Ti); and the remainder of iron (Fe) and inevitable impurities, wherein the microstructure of the base layer is full martensite.
(FR): La présente invention concerne, selon un mode de réalisation, une pièce estampée à chaud comprenant, en tant que couche de base, un acier comprenant : de 0,28 à 0,38 % en poids de carbone (C) ; de 0,1 à 0,4 % en poids de silicium (Si) ; de 1,2 à 2,0 % en poids de manganèse (Mn) ; de plus de 0 à 0,020 % en poids de phosphore (P) ; de plus de 0 à 0,003 % en poids de soufre (S) ; de 0,1 à 0,5 % en poids de chrome (Cr) ; de 0,0015 à 0,0040 % en poids de bore (B) ; de 0,025 à 0,05 % en poids de titane (Ti) ; et le reste étant composé de fer (Fe) et d'impuretés inévitables, la microstructure de la couche de base étant intégralement composée de martensite.
(KO): 본 발명의 일 실시예에 따른 핫 스탬핑 부품은 탄소(C): 0.28 ~ 0.38 중량%, 규소(Si): 0.1 ~ 0.4 중량%, 망간(Mn): 1.2 ~ 2.0 중량%, 인(P): 0 초과 0.020 중량% 이하, 황(S): 0 초과 0.003 중량% 이하, 크롬(Cr): 0.1 ~ 0.5 중량%, 붕소(B): 0.0015 ~ 0.0040 중량%, 티타늄(Ti): 0.025 ~ 0.05 중량%, 및 잔부의 철(Fe)과 불가피한 불순물로 조성되는 강재를 소지층으로 포함하며, 상기 소지층의 미세조직은 풀 마르텐사이트(full martensite)이다.

International search report:
Received at International Bureau: 04 June 2020 (04.06.2020) [KR]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM