(12) International Application Status Report

Received at International Bureau: 05 February 2020 (05.02.2020)

Information valid as of: 13 July 2020 (13.07.2020)

Report generated on: 16 June 2021 (16.06.2021)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2020/16225013 August 2020 (13.08.2020) Japanese (JA)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/JP2020/00274827 January 2020 (27.01.2020) Japanese (JA)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
2019-021207 (JP)08 February 2019 (08.02.2019) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
G01D 11/30 (2006.01); H01F 7/02 (2006.01)

(71) Applicant(s):
SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041 (JP) (for all designated states)

(72) Inventor(s):
KURIYAMA, Hiromitsu; c/o SUMITOMO ELECTRIC INDUSTRIES, LTD., 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041 (JP)

(74) Agent(s):
KITANO, Shuhei; K&T IP LAW FIRM, Kitahama 1-Chome Heiwa Bldg. 9F, 1-14, Kitahama 1-chome, Chuo-ku, Osaka-shi, Osaka 5410041 (JP)

(54) Title (EN): SENSOR MODULE
(54) Title (FR): MODULE DE CAPTEUR
(54) Title (JA): センサモジュール

(57) Abstract:
(EN): This sensor module comprises: a sensor unit; a housing that has an adhesion surface and that accommodates the sensor unit; and a first magnet that is adhered to the housing. The magnetism between the first magnet and an attachment object is stronger than the adhesion between the housing and the first magnet.
(FR): Ce module de capteur comprend : une unité de capteur ; un boîtier qui a une surface d'adhérence et qui reçoit l'unité de capteur ; et un premier aimant qui est collé au boîtier. Le magnétisme entre le premier aimant et un objet de fixation est plus fort que l'adhérence entre le boîtier et le premier aimant.
(JA): センサモジュールは、センサ部と、接着面を有し、センサ部を収容する筐体と、筐体に接着される第1磁石と、を備える。第1磁石と取り付け対象物との間の磁力は、筐体と第1磁石との接着力よりも強い。

International search report:
Received at International Bureau: 09 March 2020 (09.03.2020) [JP]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, WS, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM