(12) International Application Status Report

Received at International Bureau: 26 December 2018 (26.12.2018)

Information valid as of: 26 December 2018 (26.12.2018)

Report generated on: 28 September 2020 (28.09.2020)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2020/12141018 June 2020 (18.06.2020) Japanese (JA)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/JP2018/04551711 December 2018 (11.12.2018) Japanese (JA)


(51) International Patent Classification:
C08J 5/18 (2006.01); C08G 59/24 (2006.01)

(71) Applicant(s):
HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP) (for all designated states)

(72) Inventor(s):
TANAKA, Shingo; c/o HITACHI, LTD., 6-6, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008280 (JP)
TAKEZAWA, Yoshitaka; c/o Hitachi Chemical Company, Ltd., 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)
KIGUCHI, Kazuya; c/o Hitachi Chemical Company, Ltd., 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP)

(74) Agent(s):
TAIYO, NAKAJIMA & KATO; 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022 (JP)

(54) Title (EN): EPOXY RESIN B STAGE FILM, EPOXY RESIN CURED FILM, AND METHOD FOR PRODUCING EPOXY RESIN CURED FILM
(54) Title (FR): FILM DE STADE B DE RÉSINE ÉPOXY, FILM DURCI DE RÉSINE ÉPOXY ET PROCÉDÉ DE PRODUCTION DE FILM DURCI DE RÉSINE ÉPOXY
(54) Title (JA): エポキシ樹脂Bステージフィルム、エポキシ樹脂硬化フィルム、及びエポキシ樹脂硬化フィルムの製造方法

(57) Abstract:
(EN): This epoxy resin B stage film is obtained by semi-curing an epoxy resin composition that contains a curing agent and a liquid crystalline epoxy monomer capable of forming a cured product including a liquid crystal structure, the epoxy resin B stage film being such that: the average thickness is less than 8 μm; and, upon curing, the liquid crystal structure included in the cured product becomes a liquid crystal structure in which the molecules are oriented in the film thickness direction.
(FR): L'invention concerne un film de stade B de résine époxy obtenu par le semi-durcissement d'une composition de résine époxy qui contient un agent de durcissement et un monomère époxy cristallin liquide capable de former un produit durci comprenant une structure de cristaux liquides, le film de stade B de résine époxy étant tel que : son épaisseur moyenne est inférieure à 8 µm ; et, après durcissement, la structure de cristaux liquides comprise dans le produit durci devient une structure de cristaux liquides dans laquelle les molécules sont orientées dans la direction de l'épaisseur du film.
(JA): エポキシ樹脂Bステージフィルムは、液晶構造を含む硬化物を形成可能な液晶性エポキシモノマーと、硬化剤と、を含有するエポキシ樹脂組成物を半硬化させたものであり、平均厚みが8μm未満であり、硬化することで、前記硬化物に含まれる液晶構造が、フィルムの膜厚方向に分子が配向した液晶構造となるフィルムである。

International search report:
Received at International Bureau: 25 March 2019 (25.03.2019) [JP]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM