(12) International Application Status Report

Received at International Bureau: 11 December 2019 (11.12.2019)

Information valid as of: 26 May 2020 (26.05.2020)

Report generated on: 26 September 2020 (26.09.2020)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2020/11628411 June 2020 (11.06.2020) Japanese (JA)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/JP2019/04638527 November 2019 (27.11.2019) Japanese (JA)

(31) Priority number(s): (32) Priority date(s): (33) Priority status:
2018-228525 (JP)05 December 2018 (05.12.2018) Priority document received (in compliance with PCT Rule 17.1)

(51) International Patent Classification:
H01L 23/00 (2006.01); H01L 21/301 (2006.01)

(71) Applicant(s):
LINTEC CORPORATION [JP/JP]; 23-23, Honcho, Itabashi-ku, Tokyo 1730001 (JP) (for all designated states)

(72) Inventor(s):
KOBASHI Rikiya; c/o LINTEC Corporation, 23-23, Honcho, Itabashi-ku, Tokyo 1730001 (JP)

(74) Agent(s):
NISHIZAWA Kazuyoshi; 1-9-2, Marunouchi, Chiyoda-ku, Tokyo 1006620 (JP)

(54) Title (EN): PROTECTIVE FILM FORMING COMPOSITE SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
(54) Title (FR): FEUILLE COMPOSITE DE FORMATION DE FILM DE PROTECTION ET PROCÉDÉ DE FABRICATION D'UNE PUCE SEMI-CONDUCTRICE
(54) Title (JA): 保護膜形成用複合シート、及び半導体チップの製造方法

(57) Abstract:
(EN): According to the present invention, the half-life of the charged voltage of a protective film forming composite sheet (101) is set to 20 seconds or less, the protective film forming composite sheet being provided with: a support sheet (10); and a protective film forming film (13) formed on a first surface (10a) of the support sheet (10).
(FR): Selon la présente invention, la demi-vie de la tension chargée d'une feuille composite de formation de film de protection (101) est fixée à 20 secondes au maximum, la feuille composite de formation de film de protection étant pourvue : d'une feuille de support (10) ; et d'un film de formation de film de protection (13) formé sur une première surface (10a) de la feuille de support (10).
(JA): 支持シート(10)と、支持シート(10)の第1面(10a)上に形成された保護膜形成用フィルム(13)と、を備えた保護膜形成用複合シート(101)の帯電圧の半減期を、20秒以下とする。

International search report:
Received at International Bureau: 10 February 2020 (10.02.2020) [JP]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM