(12) International Application Status Report

Received at International Bureau: 03 January 2019 (03.01.2019)

Information valid as of: 08 August 2019 (08.08.2019)

Report generated on: 22 September 2020 (22.09.2020)

(10) Publication number: (43) Publication date: (26) Publication language:
WO 2020/11461711 June 2020 (11.06.2020) English (EN)

(21) Application number: (22) Filing date: (25) Filing language:
PCT/EP2018/08405907 December 2018 (07.12.2018) English (EN)


(51) International Patent Classification:
A61N 1/375 (2006.01)

(71) Applicant(s):
PIXIUM VISION SA [FR/FR]; 74 Rue du Faubourg Saint Antoine 75012 Paris (FR) (for all designated states)

(72) Inventor(s):
DETERRE, Martin; 36, rue de Wattignies 75012 Paris (FR)

(74) Agent(s):
GRAF VON STOSCH PATENTANWALTSGESELLSCHAFT MBH; Prinzregentenstr. 22 80538 Munich (DE)

(54) Title (EN): HERMETIC PACKAGING OF ELECTRONIC COMPONENTS
(54) Title (FR): BOÎTIER HERMÉTIQUE POUR COMPOSANTS ÉLECTRONIQUES

(57) Abstract:
(EN): The present invention relates to the field of electronic devices, in particular implantable electronic devices, e.g. for bio-medical applications, and more particularly, to hermetically packaged electronic devices for bio-medical in vivo applications and packaging methods for such electronic devices.
(FR): La présente invention concerne le domaine des dispositifs électroniques, en particulier des dispositifs électroniques implantables, par exemple pour des applications biomédicales, et plus particulièrement, des dispositifs électroniques encapsulés hermétiquement pour des applications biomédicales in vivo et des procédés d'encapsulation pour de tels dispositifs électroniques.

International search report:
Received at International Bureau: 31 July 2019 (31.07.2019) [EP]

International Report on Patentability (IPRP) Chapter II of the PCT:
Not available

(81) Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
European Patent Office (EPO) : AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
African Intellectual Property Organization (OAPI) : BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG
African Regional Intellectual Property Organization (ARIPO) : BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW
Eurasian Patent Organization (EAPO) : AM, AZ, BY, KG, KZ, RU, TJ, TM